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公开(公告)号：US5803957A
公开(公告)日：1998-09-08
申请号：US782564
申请日：1997-01-10
Applicant: Tooru Murakami , Keizin Morimoto , Isamu Yanada , Masanobu Tsujimoto
Inventor： Tooru Murakami , Keizin Morimoto , Isamu Yanada , Masanobu Tsujimoto
CPC classification number: C23C18/44
Abstract: To an electroless gold plating bath comprising a water-soluble gold compound, a complexing agent, and a reducing agent is added a small amount of polyvinyl pyrrodidone. The bath allows a satisfactory gold plating film to be formed on metal portions on a non-conductive substrate without plating spread.
Abstract translation: 向包含水溶性金化合物，络合剂和还原剂的无电镀金液中加入少量聚乙烯吡咯烷酮。 该浴可以在非导电性基板上的金属部分上形成满意的镀金膜，而不会电镀。
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公开(公告)号：US06508927B2
公开(公告)日：2003-01-21
申请号：US09433887
申请日：1999-11-04
Applicant: Isamu Yanada , Masanobu Tsujimoto , Tetsurou Okada , Teruya Oka , Hideyuki Tsubokura
Inventor： Isamu Yanada , Masanobu Tsujimoto , Tetsurou Okada , Teruya Oka , Hideyuki Tsubokura
IPC: C25D358
CPC classification number: C25D3/60
Abstract: A tin-copper alloy electroplating bath which comprises a water-soluble tin salt, a water-soluble copper salt, an inorganic or organic acid or a water-soluble salt thereof, and one or more compounds selected from thioamide compounds and thiol compounds. The present invention makes it possible to form a tin-copper alloy deposit, in place of tin-lead alloy plating, on electronic parts such as chips, quartz crystal oscillators, hoops, connector pins, lead frames, bumps, lead pins of packages, and printed circuit boards.
Abstract translation: 一种锡 - 铜合金电镀浴，其包含水溶性锡盐，水溶性铜盐，无机或有机酸或其水溶性盐，以及一种或多种选自硫代酰胺化合物和硫醇化合物的化合物。 本发明使得可以在诸如芯片，石英晶体振荡器，环，连接器引脚，引线框架，凸块，封装引脚的电子部件上形成锡 - 铜合金镀层，代替锡 - 铅合金电镀， 和印刷电路板。
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公开(公告)号：US20090223830A1
公开(公告)日：2009-09-10
申请号：US12089025
申请日：2006-10-02
Applicant: Masanobu Tsujimoto , Isamu Yanada , Katsuaki Suganuma , Keunsoo Kim
Inventor： Masanobu Tsujimoto , Isamu Yanada , Katsuaki Suganuma , Keunsoo Kim
IPC: C25D3/54 , C25D3/46 , C25D3/50 , C25D3/48 , C25D3/12 , C25D3/20 , C25D3/26 , C25D3/38 , C25D3/34 , C25D3/22 , C25D3/00
CPC classification number: C25D5/10 , B32B15/01 , B32B15/018 , C22C13/00 , C22C13/02 , C25D5/02 , C25D7/00 , H01L2924/0002 , H01R13/03 , H05K3/244 , H05K2201/0347 , H05K2201/0769 , H01L2924/00
Abstract: A surface treatment method of cladding a Sn or Sn alloy coating with one or more metals selected from among Mn, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, In, Ti, Ge, Pb, Sb and Bi continuously or discontinuously in such a way as to make the Sn or Sn alloy coating partially exposed, which method makes it possible to inhibit the generation of whiskers in an Sn or Sn alloy coating formed on the surface of a substrate to which other member is pressure-welded or the joint surface to be soldered. Cladding an Sn or Sn alloy coating with a prescribed metal continuously or discontinuously in such a way as to make the coating partially exposed inhibits the generation of whiskers by contact pressure in pressure welding, and further inhibits the generation of whiskers without impairing the solder wettability of the coating even when the cladding is not followed by heat treatment or reflowing.
Abstract translation: 一种用一种或多种选自Mn，Fe，Ru，Os，Co，Rh，Ir，Ni，Pd，Pt，Cu，Ag，Au，Zn，Cd中的一种或多种金属包覆Sn或Sn合金涂层的表面处理方法， Ga，In，Ti，Ge，Pb，Sb和Bi，以使Sn或Sn合金涂层部分露出的方式连续或不连续地使用，可以抑制Sn或Sn合金涂层中的晶须的产生 形成在其他构件被压焊的基板的表面上，或者形成在待焊接的接合面上。 连续地或不连续地以规定的金属包覆Sn或Sn合金涂层以使得涂层部分露出的方式通过压焊中的接触压力抑制晶须的产生，并且进一步抑制晶须的产生而不损害焊料润湿性 涂层即使当包覆层没有经过热处理或回流时也是如此。
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Patent Agency Ranking4.发明授权Tin-silver alloy electroplating bath and tin-silver alloy electroplating process 失效锡银合金电镀浴和锡 - 银合金电镀工艺
公开(公告)号：US6099713A
公开(公告)日：2000-08-08
申请号：US977658
申请日：1997-11-24
Applicant: Isamu Yanada , Masanobu Tsujimoto
Inventor： Isamu Yanada , Masanobu Tsujimoto
CPC classification number: H05K3/3473 , C25D3/60 , H05K3/3463
Abstract: Disclosed is a tin-silver alloy electroplating bath containing: (A) stannous salt; (B) silver salt; (C) one kind or two or more kinds of acids selected from the group consisting of sulfuric acid, phosphoric acid, phosphonic acid, hydroxycarboxylic acid, alkanesulfonic acid, and alkanolsulfonic acid; (D) thiourea; (E) nonionic surface active agent; and (F) one kind or two or more kinds of additives selected from the group consisting of a mercapto group containing aromatic compound, dioxyaromatic compound, and unsaturated carboxylic acid. The electroplating using the above electroplating bath is allowed to form a homogeneous tin-silver alloy plated film having a good external appearance by eliminating preferential deposition of silver and substitutional deposition of silver on an anode and the plated film.
Abstract translation: 公开了一种锡 - 银合金电镀浴，其含有：（A）亚锡盐; （B）银盐; （C）选自硫酸，磷酸，膦酸，羟基羧酸，链烷磺酸和烷醇磺酸中的一种或两种以上的酸; （D）硫脲; （E）非离子表面活性剂; 和（F）选自由含巯基的芳族化合物，二氧杂芳族化合物和不饱和羧酸组成的组中的一种或两种以上的添加剂。 使用上述电镀浴的电镀通过消除银的优先沉积和银的替代沉积在阳极和镀膜上形成具有良好外观的均匀的锡 - 银合金镀膜。
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公开(公告)号：US08821708B2
公开(公告)日：2014-09-02
申请号：US12089025
申请日：2006-10-02
Applicant: Masanobu Tsujimoto , Isamu Yanada , Katsuaki Suganuma , Keunsoo Kim
Inventor： Masanobu Tsujimoto , Isamu Yanada , Katsuaki Suganuma , Keunsoo Kim
CPC classification number: C25D5/10 , B32B15/01 , B32B15/018 , C22C13/00 , C22C13/02 , C25D5/02 , C25D7/00 , H01L2924/0002 , H01R13/03 , H05K3/244 , H05K2201/0347 , H05K2201/0769 , H01L2924/00
Abstract: A surface treatment method of cladding a Sn or Sn alloy coating with one or more metals selected from among Mn, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, In, Ti, Ge, Pb, Sb and Bi continuously or discontinuously in such a way as to make the Sn or Sn alloy coating partially exposed, which method makes it possible to inhibit the generation of whiskers in an Sn or Sn alloy coating formed on the surface of a substrate to which other member is pressure-welded or the joint surface to be soldered. Cladding an Sn or Sn alloy coating with a prescribed metal continuously or discontinuously in such a way as to make the coating partially exposed inhibits the generation of whiskers by contact pressure in pressure welding, and further inhibits the generation of whiskers without impairing the solder wettability of the coating even when the cladding is not followed by heat treatment or reflowing.
Abstract translation: 一种用一种或多种选自Mn，Fe，Ru，Os，Co，Rh，Ir，Ni，Pd，Pt，Cu，Ag，Au，Zn，Cd中的一种或多种金属包覆Sn或Sn合金涂层的表面处理方法， Ga，In，Ti，Ge，Pb，Sb和Bi，以使Sn或Sn合金涂层部分露出的方式连续或不连续地使用，可以抑制Sn或Sn合金涂层中的晶须的产生 形成在其他构件被压焊的基板的表面上，或者形成在待焊接的接合面上。 连续地或不连续地以规定的金属包覆Sn或Sn合金涂层以使得涂层部分露出的方式通过压焊中的接触压力抑制晶须的产生，并且进一步抑制晶须的产生而不损害焊料润湿性 涂层即使当包覆层没有经过热处理或回流时也是如此。
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6.发明申请TIN ELECTROPLATING BATH, TIN PLATING FILM, TIN ELECTROPLATING METHOD, AND ELECTRONIC DEVICE COMPONENT 有权TIN电镀浴，TIN电镀膜，TIN电镀方法和电子器件组件公开(公告)号：US20090098398A1
公开(公告)日：2009-04-16
申请号：US12282483
申请日：2007-04-06
Applicant: Isamu Yanada , Masanobu Tsujimoto
Inventor： Isamu Yanada , Masanobu Tsujimoto
CPC classification number: C25D3/30 , C25D3/32 , C25D3/60 , C25D7/12 , H01L23/49582 , H01L24/11 , H01L24/27 , H01L2224/11822 , H01L2924/01004 , H01L2924/01005 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01084 , H01L2924/01327 , H01L2924/04953 , H01L2924/09701 , H05K3/244 , Y10T428/31678
Abstract: Disclosed is a tin electroplating bath containing a water-soluble tin salt, one or more substances selected from inorganic acids, organic acids and their water-soluble salts, and one or more substances selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts. This tin electroplating bath enables to form a tin-plated coating film on components for electronic devices such as a chip component, crystal oscillator, bump, connector, lead frame, hoop member, semiconductor package and printed board, as a substitute for a tin-lead alloy plating material, while having high whisker suppressing effects.
Abstract translation: 公开了一种含有水溶性锡盐，一种或多种选自无机酸，有机酸及其水溶性盐的物质的锡电镀浴，以及一种或多种选自水溶性钨盐，水溶性钼盐 和水溶性锰盐。 该锡电镀浴能够在诸如芯片部件，晶体振荡器，凸块，连接器，引线框架，箍部件，半导体封装和印刷电路板的电子器件的部件上形成镀锡涂层膜， 铅合金电镀材料，同时具有高晶须抑制效果。
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7.发明授权公开(公告)号：US08440066B2
公开(公告)日：2013-05-14
申请号：US12282483
申请日：2007-04-06
Applicant: Isamu Yanada , Masanobu Tsujimoto
Inventor： Isamu Yanada , Masanobu Tsujimoto
CPC classification number: C25D3/30 , C25D3/32 , C25D3/60 , C25D7/12 , H01L23/49582 , H01L24/11 , H01L24/27 , H01L2224/11822 , H01L2924/01004 , H01L2924/01005 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01084 , H01L2924/01327 , H01L2924/04953 , H01L2924/09701 , H05K3/244 , Y10T428/31678
Abstract: Disclosed is a tin electroplating bath containing a water-soluble tin salt, one or more substances selected from inorganic acids, organic acids and their water-soluble salts, and one or more substances selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts. This tin electroplating bath enables to form a tin-plated coating film on components for electronic devices such as a chip component, crystal oscillator, bump, connector, lead frame, hoop member, semiconductor package and printed board, as a substitute for a tin-lead alloy plating material, while having high whisker suppressing effects.
Abstract translation: 公开了一种含有水溶性锡盐，一种或多种选自无机酸，有机酸及其水溶性盐的物质的锡电镀浴，以及一种或多种选自水溶性钨盐，水溶性钼盐 和水溶性锰盐。 该锡电镀浴能够在诸如芯片部件，晶体振荡器，凸块，连接器，引线框架，箍部件，半导体封装和印刷电路板的电子器件的部件上形成镀锡涂层膜， 铅合金电镀材料，同时具有高晶须抑制效果。
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公开(公告)号：US5185076A
公开(公告)日：1993-02-09
申请号：US684321
申请日：1991-04-12
Applicant: Isamu Yanada , Tooru Murakami , Kiyoshi Asakawa
Inventor： Isamu Yanada , Tooru Murakami , Kiyoshi Asakawa
CPC classification number: C25D3/60
Abstract: A bath for electrodepositing tin, lead or an alloy thereof, containing a tin and/or lead ion and a sulfate ion becomes stable at pH 1 or higher when a condensed phosphate ion is added thereto. The bath is effective for depositing tin-lead alloy films on sealing glass-metal integrated articles.
Abstract translation: 当向其中加入缩合的磷酸根离子时，含有锡和/或铅离子和硫酸根离子的锡，铅或其合金的电沉积浴在pH 1或更高时变得稳定。 该浴对于在密封玻璃金属一体制品上沉积锡铅合金膜是有效的。
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