Invention Grant
- Patent Title: Lead-free conductive paste composition
- Patent Title (中): 无铅导电糊组合物
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Application No.: US13109525Application Date: 2011-05-17
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Publication No.: US08440111B2Publication Date: 2013-05-14
- Inventor: Rong-Zhi Chen , Hung-Shuo Chung , Chin-Lin Huang , Jye-Long Lee , Shu-Hua Chen , Jui-Tung Chang
- Applicant: Rong-Zhi Chen , Hung-Shuo Chung , Chin-Lin Huang , Jye-Long Lee , Shu-Hua Chen , Jui-Tung Chang
- Applicant Address: TW Kaohsiung
- Assignee: China Steel Corporation
- Current Assignee: China Steel Corporation
- Current Assignee Address: TW Kaohsiung
- Agency: Caesar, Rivise, Bernstein, Cohen & Pokotilow, Ltd.
- Priority: TW99146910A 20101230
- Main IPC: H01B1/16
- IPC: H01B1/16 ; H01B1/22
Abstract:
A lead-free conductive paste composition includes silumin powder, lead-free glass frits, an organic binder, stearic acid zinc, and aluminum powder.
Public/Granted literature
- US20120168689A1 LEAD-FREE CONDUCTIVE PASTE COMPOSITION Public/Granted day:2012-07-05
Information query
