发明授权
US08440313B2 Crosslinkable thermoset monomer, composition for producing printed circuit board comprising the thermoset monomer and printed circuit board using the composition
有权
可交联的热固性单体，使用该组合物制造包含热固性单体和印刷电路板的印刷电路板的组合物
- 专利标题： Crosslinkable thermoset monomer, composition for producing printed circuit board comprising the thermoset monomer and printed circuit board using the composition
- 专利标题（中）： 可交联的热固性单体，使用该组合物制造包含热固性单体和印刷电路板的印刷电路板的组合物
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申请号： US12332931申请日： 2008-12-11
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公开(公告)号： US08440313B2公开(公告)日： 2013-05-14
- 发明人: Chung Kun Cho , Myung Sup Jung , Mahn Jong Kim , Jin Young Bae , Chung Won Park
- 申请人： Chung Kun Cho , Myung Sup Jung , Mahn Jong Kim , Jin Young Bae , Chung Won Park
- 申请人地址： KR KR KR KR
- 专利权人： Samsung Electronics Co., Ltd.,Samsung Electro-Mechanics Co., Ltd.,Samsung Fine Chemicals Co., Ltd.,Sungkyunkwan University Foundation For Corporate Collaboration
- 当前专利权人： Samsung Electronics Co., Ltd.,Samsung Electro-Mechanics Co., Ltd.,Samsung Fine Chemicals Co., Ltd.,Sungkyunkwan University Foundation For Corporate Collaboration
- 当前专利权人地址： KR KR KR KR
- 代理机构： Cantor Colburn LLP
- 优先权： KR10-2008-0056003 20080613
- 主分类号： B32B15/08
- IPC分类号： B32B15/08 ; B32B15/20 ; C08L49/00
摘要：
Disclosed herein is a crosslinkable thermoset monomer. The crosslinkable thermoset monomer has acetylene groups as crosslinking groups introduced at both ends of the backbone. Also disclosed herein is a composition for producing a printed circuit board which comprises the crosslinkable thermoset monomer. The composition exhibits excellent mechanical and thermal properties. Therefore, the composition can be used as a material for next-generation boards that are becoming lighter in weight and smaller in size and thickness. Also disclosed herein is a printed circuit board using the composition.
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