摘要:
A compound shown by the following general formula (1-1), AR1 and AR2 each independently represent an aromatic ring or an aromatic ring containing at least one nitrogen and/or sulfur atom, two AR1s, AR1 and AR2, or two AR2s are optionally bonded; AR3 represents a benzene, naphthalene, thiophene, pyridine, or diazine ring; A represents an organic group; B represents an anionic leaving group; Y represents a divalent organic group; “p” is 1 or 2; “q” is 1 or 2; “r” is 0 or 1; “s” is 2 to 4; when s=2, Z represents a single bond, divalent atom, or divalent organic group; and when s=3 or 4, Z represents a trivalent or quadrivalent atom or organic group. This compound cures to form an organic film, and also forms an organic under layer film.
摘要:
A compound shown by the following general formula (1-1), AR1 and AR2 each independently represent an aromatic ring or an aromatic ring containing at least one nitrogen and/or sulfur atom, two AR1s, AR1 and AR2, or two AR2s are optionally bonded; AR3 represents a benzene, naphthalene, thiophene, pyridine, or diazine ring; A represents an organic group; B represents an anionic leaving group; Y represents a divalent organic group; “p” is 1 or 2; “q” is 1 or 2; “r” is 0 or 1; “s” is 2 to 4; when s=2, Z represents a single bond, divalent atom, or divalent organic group; and when s=3 or 4, Z represents a trivalent or quadrivalent atom or organic group. This compound cures to form an organic film, and also forms an organic under layer film.
摘要:
Disclosed herein is a crosslinkable thermoset monomer. The crosslinkable thermoset monomer has acetylene groups as crosslinking groups introduced at both ends of the backbone. Also disclosed herein is a composition for producing a printed circuit board which comprises the crosslinkable thermoset monomer. The composition exhibits excellent mechanical and thermal properties. Therefore, the composition can be used as a material for next-generation boards that are becoming lighter in weight and smaller in size and thickness. Also disclosed herein is a printed circuit board using the composition.
摘要:
An oligomer having di-phenylethynyl endcaps is disclosed. The capped oligomer has the formula: D-A-D whereinD is a di-phenylethynyl endcap; andA is an oligomer selected from the group consisting of imidesulfone; ether; ethersulfone; amide; imide; ester; estersulfone; etherimide; amideimide; oxazole; oxazole sulfone; thiazole; thiazole sulfone; imidazole; and imidazole sulfone.
摘要:
Described herein are substantially linear copolymeric compositions having at least two azide groups and at least two non-activated acetylene groups. The azide groups and the non-activated acetylene groups are reacted to cure the substantially linear copolymer composition. Also, described are methods of making and using such substantially linear copolymeric compositions.
摘要:
An adhesive composition of between 10-70% by weight of a latex emulsion, between 30-80% by weight of an acrylic, between 0.05-5% by weight of a surfactant, and between 1-50% by weight of water, and an adhesive application system for applying the adhesive composition having the adhesive, a propellant, a pressure container for containing the adhesive and the propellant under pressure, and a valve system to regulate the flow of the adhesive and propellant out of the pressure container.
摘要:
An aqueous bubble solution includes at least one water soluble polymer, at least one surfactant, and at least one fast drying solvent or solvent blend. The water soluble polymer forms a strong and resilient bubble wall. The surfactant(s) lowers the surface tension of the solution to create a bubble blowing film. The fast evaporating solvent or solvent blend acts to harden the bubble wall by dehydration and rapid evaporation. Bubbles blown from the solution will air dry within seconds and exhibit extraordinary strength. The bubbles do not evaporate and resist breakage upon collision with a dry surface. The bubbles remain translucent and fully preserved for hours or even days while resting on a surface.
摘要:
Deaggregated substituted and unsubstitued polyparaphenylenes, polyparaphenylevevinyles, polyanilines, polyazines, polythiophenes, poly-p-phenylene sulfides, polyfuranes, polypyrroles, polyselenophene, polyacetylenes formed from soluble precursors and combinations thereof and copolymers thereof and methods of fabrication are described. The deaggregated polymer molecules when subsequently doped show higher electrical conductivity. Agents such as lithium chloride, m-cresol and nonylphenol are used to deaggregate the polymer molecules. The deaggregating agents can be added prior to or during doping the molecules.
摘要:
Electrically conductive compositions of carbon nparticles having thin coatings of conductive polymer are disclosed. The thin coatings of conductive polymer electrically interact with each carbon particle and protect the carbon particles from conductive failure. Because the conductive compositions of coated carbon particles maintain their conductive characteristics even after long term exposure to chemicals, they are useful as filler materials in polymer compositions utilized to fabricate chemical delivery devices.
摘要:
This invention is directed to an ER elastomer composition comprising natural rubber and polarizable particles dispersed therein, which elastomer can undergo changes in Youngs modulus when subjected to an electric field and having a Youngs modulus of at least about 2 Mpa when not subject to an electric field, wherein the ratio of the electrical conductivity of the particles to the electrical conductivity of the natural rubber is between about 10.sup.4 and 10.sup.10. The invention also include variable stiffness mounts, such as engine mounts, made from the composition.