Invention Grant
- Patent Title: Micromechanical structure and method for manufacturing a micromechanical structure
- Patent Title (中): 微机械结构的微机械结构和制造方法
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Application No.: US12924641Application Date: 2010-10-01
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Publication No.: US08443671B2Publication Date: 2013-05-21
- Inventor: Johannes Classen , Christian Bierhoff
- Applicant: Johannes Classen , Christian Bierhoff
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102009045391 20091006
- Main IPC: G01P15/125
- IPC: G01P15/125

Abstract:
A micromechanical structure includes: a substrate; a seismic mass movable relative to the substrate along a first direction parallel to a main plane of extension of the substrate; a first electrode structure is connected to the substrate; and a second electrode structure connected to the substrate. The seismic mass includes a counterelectrode structure having finger electrodes situated between first finger electrodes of the first electrode structure and second finger electrodes of the second electrode structure, along the first direction. The first electrode structure is fastened to the substrate by a first anchoring element in a central region of the micromechanical structure, and the second electrode structure is anchored to the substrate by a second anchoring element situated in the central region.
Public/Granted literature
- US20110083506A1 Micromechanical structure and method for manufacturing a micromechanical structure Public/Granted day:2011-04-14
Information query
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