An anodic bonding method of anodically bonding a base wafer 10 and a lid wafer 11 includes:(1) superimposing the base wafer 10 and the lid wafer 11 onto each other in a direction where a bonding film 9 faces a cavity C; (2) subsequent to the superimposition step, pressurizing and holding the base wafer 10 and the lid wafer 11 in a vacuum state in the superimposition direction; and (3) subsequent to the pressurizing step, partitioning and setting a plurality of intended bonding areas A1, A2, A3 and A4 in a concentric form on a contacting surface where the base wafer 10 and the lid wafer 11 are in contact with each other and applying a DC voltage to each of the plurality of intended bonding areas A1, A2, A3 and A4.