Invention Grant
- Patent Title: Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers
- Patent Title (中): 具有介电层的电路化基底，其电介质组成不包括连续或半连续的纤维
-
Application No.: US11896786Application Date: 2007-09-06
-
Publication No.: US08445094B2Publication Date: 2013-05-21
- Inventor: Robert Japp , Kostas Papathomas
- Applicant: Robert Japp , Kostas Papathomas
- Applicant Address: US NY Endicott
- Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee Address: US NY Endicott
- Agency: Hinman, Howard & Kattell, LLP
- Agent Mark Levy; Lawrence R. Fraley
- Main IPC: B32B3/24
- IPC: B32B3/24 ; H05K1/03
Abstract:
A circuitized substrate which includes at least one circuit layer and at least one substantially solid dielectric layer comprised of a dielectric composition which includes a cured resin material and a predetermined percentage by weight of particulate fillers, but not including continuous or semi-continuous fibers as part thereof.
Public/Granted literature
Information query
