发明授权
- 专利标题： Multi-chip module
- 专利标题（中）： 多芯片模块
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申请号： US12902527申请日： 2010-10-12
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公开(公告)号： US08446020B2公开(公告)日： 2013-05-21
- 发明人: Masateru Koide , Daisuke Mizutani , Aiichiro Inoue , Hideo Yamashita , Iwao Yamazaki , Masayuki Kato , Seiji Ueno , Kazuyuki Imamura
- 申请人： Masateru Koide , Daisuke Mizutani , Aiichiro Inoue , Hideo Yamashita , Iwao Yamazaki , Masayuki Kato , Seiji Ueno , Kazuyuki Imamura
- 申请人地址： JP Kawasaki JP Yokohama
- 专利权人： Fujitsu Limited,Fujitsu Semiconductor Limited
- 当前专利权人： Fujitsu Limited,Fujitsu Semiconductor Limited
- 当前专利权人地址： JP Kawasaki JP Yokohama
- 代理机构： Squire Sanders (US) LLP
- 优先权： JP2009-239489 20091016
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A multi-chip module includes: a board; a wiring board disposed on the board and including a wiring pattern; and a plurality of chips disposed on the wiring board. Each of the plurality of chips is connected with at least one of the other chips, and the plurality of chips and the board are electrically connected with each other via a portion other than the wiring pattern of the wiring board.
公开/授权文献
- US20110089579A1 MULTI-CHIP MODULE 公开/授权日：2011-04-21