公开(公告)号：US20110220398A1

公开(公告)日：2011-09-15

申请号：US13113305

申请日：2011-05-23

申请人： Seiki Sakuyama ,  Toshiya Akamatsu ,  Masateru Koide

发明人： Seiki Sakuyama ,  Toshiya Akamatsu ,  Masateru Koide

IPC分类号： H05K1/09 ,  H01L21/50 ,  B23K31/02

CPC分类号： H05K1/0271 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16506 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/814 ,  H01L2224/81411 ,  H01L2224/81805 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/01083

摘要： A method of manufacturing an electronic apparatus including a first and a second components, includes: forming a first solder bump on one of the first component and the second component; forming a second solder bump on the other one of the first component and the second component; bringing the first solder bump into contact with the second solder bump at a temperature higher than the liquidus temperature of any of the first and the second solder bumps such that the first and the second solder bumps are fused together to form a solder joint of an alloy having a lower liquidus temperature than any of the first and the second solder bumps; and solidifying the solder joint between the first and the second component.

摘要翻译： 一种制造包括第一和第二部件的电子设备的方法，包括：在第一部件和第二部件之一上形成第一焊料凸块; 在所述第一部件和所述第二部件中的另一个上形成第二焊料凸块; 使得第一焊料凸点在比第一和第二焊料凸块中的任何一个的液相线温度高的温度下与第二焊料凸块接触，使得第一和第二焊料凸块熔合在一起以形成合金的焊接接头 具有比第一和第二焊料凸块中的任一个更低的液相线温度; 并固化第一和第二部件之间的焊接接头。

公开(公告)号：US20110089579A1

公开(公告)日：2011-04-21

申请号：US12902527

申请日：2010-10-12

申请人： Masateru KOIDE ,  Daisuke MIZUTANI ,  Aiichiro INOUE ,  Hideo YAMASHITA ,  Iwao YAMAZAKI ,  Masayuki KATO ,  Seiji UENO ,  Kazuyuki IMAMURA

发明人： Masateru KOIDE ,  Daisuke MIZUTANI ,  Aiichiro INOUE ,  Hideo YAMASHITA ,  Iwao YAMAZAKI ,  Masayuki KATO ,  Seiji UENO ,  Kazuyuki IMAMURA

IPC分类号： H01L23/52

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/0001 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A multi-chip module includes: a board; a wiring board disposed on the board and including a wiring pattern; and a plurality of chips disposed on the wiring board. Each of the plurality of chips is connected with at least one of the other chips, and the plurality of chips and the board are electrically connected with each other via a portion other than the wiring pattern of the wiring board.

摘要翻译： 多芯片模块包括：板; 布线板，其布置在所述板上并且包括布线图案; 以及配置在配线基板上的多个芯片。 多个芯片中的每一个与其他芯片中的至少一个连接，并且多个芯片和板通过布线板的布线图案之外的部分彼此电连接。

公开(公告)号：US20110080718A1

公开(公告)日：2011-04-07

申请号：US12888013

申请日：2010-09-22

申请人： Masateru KOIDE

发明人： Masateru KOIDE

IPC分类号： H05K1/11 ,  H01L21/50

CPC分类号： H05K3/4608 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/445 ,  H05K2201/10378 ,  H05K2201/10477 ,  H01L2924/00

摘要： An interconnect board for interconnecting and arranged between a first circuit board and a second circuit board, the interconnect board includes a first conductive plate including a first connection terminal, a first insulating member wrapping the first conductive plate except for the first connection terminal, a second conductive plate including a second connection terminal, a second insulating member wrapping the second conductive plate except for the second connection terminal, an insulating substrate arranged between the first insulating member and the second insulating member, and a conductive member penetrating the first insulating member, the second insulating member and the insulating substrate.

摘要翻译： 一种用于互连并布置在第一电路板和第二电路板之间的互连板，所述互连板包括第一导电板，所述第一导电板包括第一连接端子，第一绝缘构件，所述第一绝缘构件包围除所述第一连接端子之外的所述第一导电板， 包括第二连接端子的导电板，包围除了第二连接端子之外的第二导电板的第二绝缘构件，布置在第一绝缘构件和第二绝缘构件之间的绝缘基板，以及贯穿第一绝缘构件的导电构件， 第二绝缘构件和绝缘基板。

公开(公告)号：US20110080717A1

公开(公告)日：2011-04-07

申请号：US12887600

申请日：2010-09-22

申请人： Masateru KOIDE ,  Daisuke Mizutani

发明人： Masateru KOIDE ,  Daisuke Mizutani

IPC分类号： H05K1/11 ,  H01L21/50

CPC分类号： H05K1/141 ,  H01L23/142 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/445 ,  H05K2201/10378 ,  H05K2201/10477 ,  H01L2224/0401

摘要： An interconnect board for interconnecting and arranged between a first circuit board and a second circuit board, the interconnect board includes a conductive plate including a connection terminal to be electrically connected to a power supply terminal or a ground terminal of each of the first circuit board and the second circuit board, an insulating member wrapping the conductive plate except for the connection terminal, and a conductive member penetrating the insulating member to electrically connect a signal terminal of the first circuit board to a signal terminal of the second circuit board.

摘要翻译： 一种用于互连并布置在第一电路板和第二电路板之间的互连板，所述互连板包括导电板，所述导电板包括电连接到所述第一电路板的电源端子或接地端子的连接端子，以及 所述第二电路板，除了所述连接端子之外包覆所述导电板的绝缘构件以及穿过所述绝缘构件的导电构件将所述第一电路板的信号端子电连接到所述第二电路板的信号端子。

公开(公告)号：US20110042806A1

公开(公告)日：2011-02-24

申请号：US12857884

申请日：2010-08-17

申请人： Masateru Koide ,  Daisuke Mizutani

发明人： Masateru Koide ,  Daisuke Mizutani

IPC分类号： H01L23/538 ,  H01L21/60

CPC分类号： H01L24/17 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of manufacturing a multi-chip module includes: securing a plurality of chips on a surface of a flat-shaped member through a solder bump; connecting the plurality of chips with each other by a bonding wire, at surfaces, opposite to the flat-shaped member side, of the plurality of chips; and electrically connecting the plurality of chips with a board, at the surfaces, opposite to the flat-shaped member side, of the plurality of chips.

摘要翻译： 一种制造多芯片模块的方法包括：通过焊料凸块将多个芯片固定在平坦构件的表面上; 通过接合线在多个芯片的与平面形状构件侧相对的表面处将多个芯片彼此连接; 以及在所述多个芯片的与所述平坦构件侧相对的表面处，将所述多个芯片与板电连接。

公开(公告)号：US07291901B2

公开(公告)日：2007-11-06

申请号：US10803879

申请日：2004-03-19

申请人： Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

发明人： Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

IPC分类号： H01L23/02 ,  H01L23/48

CPC分类号： H01L23/642 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/4006 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/0401

摘要： A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.

摘要翻译： 包装方法，包装结构和包装是能够抑制薄膜基板翘曲的基板，提高产品收率，并且在安装具有高放热量的LSI的情况下建立足够的冷却能力的基板。 本发明的封装基板1使得在第一基板12中形成开口11，在第一基板12上层叠薄膜基板（第二基板）13，开口11被薄膜基板13覆盖 。 接下来，将电容器（第一电子部件）14插入到开口11中并且结合到薄膜基板上，树脂15将开口11的内部填充到固定或更大的厚度并被硬化，薄膜基板13 并且电容器14由树脂15维持，应该连接到电容器14的LSI 16（第二电子部件）被接合到薄膜基板13的暴露侧的表面上，并且电容器 14连接到LSI 16。

公开(公告)号：US07268002B2

公开(公告)日：2007-09-11

申请号：US11265107

申请日：2005-11-03

申请人： Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

发明人： Masateru Koide ,  Misao Umematsu ,  Takashi Kanda ,  Yasuhiro Usui ,  Kenji Fukuzono

IPC分类号： H01L21/66 ,  H01L21/44

CPC分类号： H01L23/642 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/4006 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/0401

摘要： A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.

公开(公告)号：US07057272B2

公开(公告)日：2006-06-06

申请号：US10986151

申请日：2004-11-12

申请人： Masateru Koide

发明人： Masateru Koide

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H05K1/0263 ,  H01L23/32 ,  H01L23/367 ,  H01L23/50 ,  H01L23/5385 ,  H01L25/162 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2224/0401

摘要： A package substrate has a power supply path different from a signal supply path to a semiconductor element. A semiconductor element is mounted on a first surface of the package substrate. A second surface opposite to the first surface is provided with external connection terminals. A power supply layer is formed inside the package substrate. The package substrate has electrode terminals provided in a part other than the second surface. The electrode terminals are connected to the power supply layer.

摘要翻译： 封装衬底具有不同于到半导体元件的信号提供路径的电源路径。 半导体元件安装在封装基板的第一表面上。 与第一表面相对的第二表面设置有外部连接端子。 电源层形成在封装衬底的内部。 封装基板具有设置在第二表面以外的部分的电极端子。 电极端子连接到电源层。

公开(公告)号：US5670067A

公开(公告)日：1997-09-23

申请号：US238735

申请日：1994-05-05

申请人： Masateru Koide ,  Hiroshi Ikeda

发明人： Masateru Koide ,  Hiroshi Ikeda

IPC分类号： B23K26/00 ,  B23K26/03 ,  B23K26/06 ,  B23K26/08 ,  B23K26/38 ,  H05K3/22 ,  H05K13/06 ,  H05K13/08 ,  B23K26/02 ,  H05K3/02

CPC分类号： B23K26/0861 ,  B23K26/032 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/066 ,  H05K13/06 ,  H05K13/08 ,  H05K3/225

摘要： An apparatus for cutting a wiring on a printed wiring board using a laser beam includes a laser oscillator for emitting a laser beam along a main optical path, a multiaxis positioning apparatus for changing the three-dimensional coordinates of a printed wiring board, an X-Y adjustment apparatus for adjusting two-dimensional coordinates, perpendicular to the main optical path, an apparatus for optically measuring a size of a wiring to be cut, and a control apparatus for controlling beam parameters of the laser beam in accordance with the measured size.

摘要翻译： 使用激光束切割印刷线路板上的布线的装置包括：沿着主光路发射激光的激光振荡器，用于改变印刷电路板的三维坐标的多轴定位装置，XY调整 用于调整垂直于主光路的二维坐标的装置，用于光学测量要切割的布线的尺寸的装置，以及用于根据所测量的尺寸控制激光束的束参数的控制装置。

公开(公告)号：US5455461A

公开(公告)日：1995-10-03

申请号：US255730

申请日：1994-06-07

申请人： Masateru Koide ,  Yasuo Kawamura

发明人： Masateru Koide ,  Yasuo Kawamura

IPC分类号： H01L21/603 ,  H01L23/485 ,  H05K1/11 ,  H05K3/22 ,  H05K3/34 ,  H05K3/40 ,  H05K3/00

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/48 ,  H01L24/78 ,  H01L24/98 ,  H05K3/225 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05556 ,  H01L2224/05647 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/48455 ,  H01L2224/4847 ,  H01L2224/48472 ,  H01L2224/48491 ,  H01L2224/48647 ,  H01L2224/48847 ,  H01L2224/4911 ,  H01L2224/78313 ,  H01L2224/85214 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19107 ,  H01L2924/20755 ,  H01L2924/351 ,  H05K1/111 ,  H05K2201/09736 ,  H05K2201/10287 ,  H05K2203/049 ,  H05K3/341 ,  H05K3/4015 ,  Y10S228/904

摘要： A wire bonding method comprising the steps of (a) disconnecting a first wire which is bonded on a first pad which is provided on a substrate, (b) forming a second pad on the first pad, and (c) bonding a second wire on the second pad, so that the second wire is electrically connected to the first pad. The step (a) may completely remove the first wire from the first pad, and the step (b) may form the second pad at least on a top surface of the first pad including a part which is damaged by the removal of the first wire. On the other hand, the step (a) may cut the first wire so that a tip end of the first wire remains bonded on the first pad, and the step (b) may form the second pad at least on a top surface of the first pad so as to completely cover the remaining tip end of the first wire.

摘要翻译： 一种引线接合方法，包括以下步骤：（a）断开接合在设置在基板上的第一焊盘上的第一焊丝，（b）在第一焊盘上形成第二焊盘，以及（c）将第二焊丝接合在 第二焊盘，使得第二导线电连接到第一焊盘。 步骤（a）可以从第一焊盘完全地去除第一焊丝，并且步骤（b）可以至少在第一焊盘的顶表面上形成第二焊盘，其包括被除去第一焊丝而损坏的部分 。 另一方面，步骤（a）可以切割第一线，使得第一线的末端保持接合在第一衬垫上，并且步骤（b）可以至少在第一衬垫的顶表面上形成第二衬垫 第一焊盘，以便完全覆盖第一焊丝的剩余末端。