Invention Grant
- Patent Title: Metal base circuit board
- Patent Title (中): 金属底座电路板
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Application No.: US12600377Application Date: 2008-05-14
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Publication No.: US08449143B2Publication Date: 2013-05-28
- Inventor: Takeshi Miyakawa , Kenji Miyata , Taiki Nishi , Yoshihiko Okajima
- Applicant: Takeshi Miyakawa , Kenji Miyata , Taiki Nishi , Yoshihiko Okajima
- Applicant Address: JP Tokyo
- Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-133113 20070518; JP2007-188145 20070719; JP2007-305389 20071127
- International Application: PCT/JP2008/058812 WO 20080514
- International Announcement: WO2008/143076 WO 20081127
- Main IPC: F21V7/00
- IPC: F21V7/00
Abstract:
Provided is a metal base circuit board having a new function of a light reflection in addition to the conventional printed circuit board function for mounting electronic parts. The metal base circuit board has a circuit arranged on a metal plate via an insulation layer. A white film is arranged at least one the insulation layer.
Public/Granted literature
- US20100164362A1 METAL BASE CIRCUIT BOARD Public/Granted day:2010-07-01
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