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    METHOD OF MANUFACTURING METAL-BASE SUBSTRATE AND METHOD OF MANUFACTURING CIRCUIT BOARD
    1.
    发明申请
    METHOD OF MANUFACTURING METAL-BASE SUBSTRATE AND METHOD OF MANUFACTURING CIRCUIT BOARD 有权
    制造金属基板的方法和制造电路板的方法

    公开(公告)号：US20130056439A1

    公开(公告)日：2013-03-07

    申请号：US13696890

    申请日：2011-04-06

    申请人： Taiki Nishi ,  Takeshi Miyakawa ,  Katsunori Yashima ,  Kensuke Okoshi ,  Hidenori Ishikura

    发明人： Taiki Nishi ,  Takeshi Miyakawa ,  Katsunori Yashima ,  Kensuke Okoshi ,  Hidenori Ishikura

    IPC分类号： H05K3/20

    CPC分类号： H05K1/056 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2203/1545 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T156/1062

    摘要： A method of manufacturing a metal-base substrate having an insulative adhesive layer and a conductor layer on a metal-based material is provided. The method includes the steps of dispersing a disperse phase in an insulative adhesive-dispersing medium that contains a wetting dispersant and constitutes the insulative adhesive layer; laminating step of laminating the insulative adhesive on the conductor foil as feeding the roll-shaped conductor foil; curing the insulative adhesive on the conductor foil under heat into a B stage state and thus forming a composite of the conductor foil and the insulative adhesive layer in the B stage state; laminating the metal-based material on the insulative adhesive layer in the B stage state to give a laminate; and then curing the insulative adhesive layer in the B stage state into a C stage state by heat pressurization of the laminate.

    摘要翻译： 提供一种在金属基材料上制造具有绝缘粘合剂层和导体层的金属基底基板的方法。 该方法包括将分散相分散在含有润湿分散剂并构成绝缘粘合剂层的绝缘粘合剂分散介质中的步骤; 将导体箔上的绝缘性粘合剂层叠的方法，是将该辊状导体箔进行输送; 将导体箔上的绝缘粘合剂加热固化成B阶段状态，从而在B阶段形成导体箔和绝缘粘合剂层的复合物; 在B阶段的状态下将金属基材料层叠在绝缘性粘合剂层上，得到层叠体; 然后通过层叠体的热加压将B阶状态的绝缘性粘合层固化成C阶段状态。

    Method of manufacturing metal-base substrate and method of manufacturing circuit board
    2.
    发明授权
    Method of manufacturing metal-base substrate and method of manufacturing circuit board 有权
    制造金属基底的方法和制造电路板的方法

    公开(公告)号：US08796145B2

    公开(公告)日：2014-08-05

    申请号：US13696890

    申请日：2011-04-06

    申请人： Taiki Nishi ,  Takeshi Miyakawa ,  Katsunori Yashima ,  Kensuke Okoshi ,  Hidenori Ishikura

    发明人： Taiki Nishi ,  Takeshi Miyakawa ,  Katsunori Yashima ,  Kensuke Okoshi ,  Hidenori Ishikura

    IPC分类号： H01L21/302 ,  H01L21/461 ,  H05K3/02 ,  H05K1/05

    CPC分类号： H05K1/056 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2203/1545 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T156/1062

    摘要： A method of manufacturing a metal-base substrate having an insulative adhesive layer and a conductor layer on a metal-based material is provided. The method includes the steps of dispersing a disperse phase in an insulative adhesive-dispersing medium that contains a wetting dispersant and constitutes the insulative adhesive layer; laminating step of laminating the insulative adhesive on the conductor foil as feeding the roll-shaped conductor foil; curing the insulative adhesive on the conductor foil under heat into a B stage state and thus forming a composite of the conductor foil and the insulative adhesive layer in the B stage state; laminating the metal-based material on the insulative adhesive layer in the B stage state to give a laminate; and then curing the insulative adhesive layer in the B stage state into a C stage state by heat pressurization of the laminate.

    摘要翻译： 提供一种在金属基材料上制造具有绝缘粘合剂层和导体层的金属基底基板的方法。 该方法包括将分散相分散在含有润湿分散剂并构成绝缘粘合剂层的绝缘粘合剂分散介质中的步骤; 将导体箔上的绝缘性粘合剂层叠的方法，是将该辊状导体箔进行输送; 将导体箔上的绝缘粘合剂加热固化成B阶段状态，从而在B阶段形成导体箔和绝缘粘合剂层的复合物; 在B阶段的状态下将金属基材料层叠在绝缘性粘合剂层上，得到层叠体; 然后通过层叠体的热加压将B阶状态的绝缘性粘合层固化成C阶段状态。

    METAL BASE CIRCUIT BOARD
    3.
    发明申请
    METAL BASE CIRCUIT BOARD 有权
    金属基座电路板

    公开(公告)号：US20110132644A1

    公开(公告)日：2011-06-09

    申请号：US12994507

    申请日：2009-05-21

    申请人： Taiki Nishi ,  Takeshi Miyakawa ,  Kiyokazu Yamazaki ,  Takashi Saiki

    发明人： Taiki Nishi ,  Takeshi Miyakawa ,  Kiyokazu Yamazaki ,  Takashi Saiki

    IPC分类号： H05K1/03

    CPC分类号： H05K1/056 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/60 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0274 ,  H05K3/0061 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252 ,  H01L2924/00

    摘要： Lifespan of LEDs can be lengthened, and the workability of the printed circuit board during circuit formation and during LED mounting can be improved.A metal base circuit board, having an insulating layer with a linear expansion coefficient of 60 ppm per degree C. or higher and 120 ppm per degree C. or lower, a metal foil provided on one side of the insulating layer, comprising a metal material with a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C. or lower, a circuit portion and a non-circuit potion having a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C. or lower, and a white film formed on top of the insulating layer, circuit portion, and non-circuit portion, the total sum of the areas of the non-circuit portion and the circuit portion on top of the insulating layer being 50% or higher and 95% or lower relative to the area of the metal foil, and the relation between the linear expansion coefficients of each of the materials being: linear expansion coefficient of insulating layer>linear expansion coefficient of metal foil>linear expansion coefficient of circuit portion and non-circuit portion.

    摘要翻译： LED的寿命可以延长，并且可以提高电路形成期间和LED安装期间印刷电路板的可加工性。 一种金属基底电路板，具有线性膨胀系数为60ppm /℃以上且120ppm /℃以下的绝缘层，设置在绝缘层一侧的金属箔，其包含金属材料 线性膨胀系数为10ppm /℃以上，35ppm /℃以下，具有线性膨胀系数为10ppm /℃以上且35ppm的电路部分和非电路部分 以及形成在绝缘层，电路部分和非电路部分之上的白色膜，绝缘层顶部的非电路部分和电路部分的面积的总和 相对于金属箔的面积为50％以上且95％以下，各材料的线膨胀系数之间的关系为：绝缘层的线膨胀系数>金属箔的线膨胀系数>线膨胀 系数o f电路部分和非电路部分。

    Metal base circuit board
    7.
    发明授权
    Metal base circuit board 有权
    金属底座电路板

    公开(公告)号：US08426740B2

    公开(公告)日：2013-04-23

    申请号：US12994507

    申请日：2009-05-21

    申请人： Taiki Nishi ,  Takeshi Miyakawa ,  Kiyokazu Yamazaki ,  Takashi Saiki

    发明人： Taiki Nishi ,  Takeshi Miyakawa ,  Kiyokazu Yamazaki ,  Takashi Saiki

    IPC分类号： H05K1/03

    CPC分类号： H05K1/056 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/60 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0274 ,  H05K3/0061 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252 ,  H01L2924/00

    摘要： A metal base circuit board, having an insulating layer with a linear expansion coefficient of 60 ppm per degree C. or higher and 120 ppm per degree C. or lower, a metal foil provided on one side of the insulating layer, comprising a metal material with a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C. or lower, a circuit portion and a non-circuit potion having a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C. or lower, and a white film formed on top of the insulating layer, circuit portion, and non-circuit portion, the total sum of the areas of the non-circuit portion and the circuit portion on top of the insulating layer being 50% or higher and 95% or lower relative to the area of the metal foil and the relation between the linear expansion coefficients of each of the materials being: linear expansion coefficient of insulating layer>linear expansion coefficient of metal foil>linear expansion coefficient of circuit portion and non-circuit portion, such that Lifespan of LEDs can be lengthened, and the workability of the printed circuit board during circuit formation and during LED mounting can be improved.

    摘要翻译： 一种金属基底电路板，具有线性膨胀系数为60ppm /℃以上且120ppm /℃以下的绝缘层，设置在绝缘层一侧的金属箔，其包含金属材料 线性膨胀系数为10ppm /℃以上，35ppm /℃以下，具有线性膨胀系数为10ppm /℃以上且35ppm的电路部分和非电路部分 以及形成在绝缘层，电路部分和非电路部分之上的白色膜，绝缘层顶部的非电路部分和电路部分的面积的总和 相对于金属箔的面积为50％以上且95％以下，各材料的线膨胀系数之间的关系为：绝缘层的线膨胀系数>金属箔的线膨胀系数>线膨胀系数 的 电路部分和非电路部分，使得LED的寿命可以延长，并且可以提高电路形成期间和LED安装期间印刷电路板的可加工性。