发明授权
- 专利标题： Circuit device having an improved heat dissipitation, and the method of manufacturing the same
- 专利标题（中）： 具有改善的散热的电路装置及其制造方法
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申请号： US13240870申请日： 2011-09-22
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公开(公告)号： US08450837B2公开(公告)日： 2013-05-28
- 发明人: Shigeki Mashimo , Fumio Horiuchi , Kiyoaki Kudo , Akira Sakurai , Yuhki Inagaki
- 申请人： Shigeki Mashimo , Fumio Horiuchi , Kiyoaki Kudo , Akira Sakurai , Yuhki Inagaki
- 申请人地址： BM Hamilton
- 专利权人： ON Semiconductor Trading, Ltd.
- 当前专利权人： ON Semiconductor Trading, Ltd.
- 当前专利权人地址： BM Hamilton
- 代理机构： Morrison & Foerster LLP
- 优先权： JP2010-213693 20100924
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/60
摘要：
In a hybrid integrated circuit device, a circuit board on which an island portion of a lead is fixedly attached and a control board on which a control element and the like are mounted are disposed in an overlapping manner. The circuit board and the control board are integrally encapsulated with an encapsulating resin. A transistor disposed on an upper surface of the circuit board and a control element mounted on an upper surface of the control board are also covered by the encapsulating resin. Thus, a module in which an inverter circuit and a control circuit are integrally encapsulated with resin is provided.
公开/授权文献
- US20120074552A1 CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME 公开/授权日：2012-03-29
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