公开(公告)号：US20120075816A1

公开(公告)日：2012-03-29

申请号：US13242202

申请日：2011-09-23

申请人： Shigeki MASHIMO ,  Fumio Horiuchi ,  Kiyoaki Kudo ,  Akira Sakurai ,  Yuhki Inagaki

发明人： Shigeki MASHIMO ,  Fumio Horiuchi ,  Kiyoaki Kudo ,  Akira Sakurai ,  Yuhki Inagaki

IPC分类号： H05K7/00 ,  H05K3/00

CPC分类号： H02M7/537 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/20753 ,  H05K1/0203 ,  H05K1/181 ,  Y10T29/4916 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00012

摘要： In a hybrid integrated circuit device of the present invention, leads are fixedly attached on the upper surface of a circuit board. The lead includes an island portion, a slope portion, and a lead portion. A transistor and a diode are mounted on the upper surface of the island portion. Electrodes provided on the upper surfaces of the transistor and the diode are connected to a bonding portion through a fine metal wire. The bonding portion of the lead is disposed at a higher position than the island portion. Thus, the fine metal wires connected to the bonding portion are separated from each other.

摘要翻译： 在本发明的混合集成电路装置中，引线固定在电路板的上表面上。 引线包括岛部分，斜坡部分和引线部分。 晶体管和二极管安装在岛部的上表面上。 设置在晶体管和二极管的上表面上的电极通过细金属线连接到接合部分。 引线的接合部分设置在比岛部更高的位置。 因此，与接合部连接的细金属线彼此分离。

公开(公告)号：US08450837B2

公开(公告)日：2013-05-28

申请号：US13240870

申请日：2011-09-22

申请人： Shigeki Mashimo ,  Fumio Horiuchi ,  Kiyoaki Kudo ,  Akira Sakurai ,  Yuhki Inagaki

发明人： Shigeki Mashimo ,  Fumio Horiuchi ,  Kiyoaki Kudo ,  Akira Sakurai ,  Yuhki Inagaki

IPC分类号： H01L23/495 ,  H01L23/60

CPC分类号： H01L23/49531 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48095 ,  H01L2224/85399 ,  H01L2224/05599

摘要： In a hybrid integrated circuit device, a circuit board on which an island portion of a lead is fixedly attached and a control board on which a control element and the like are mounted are disposed in an overlapping manner. The circuit board and the control board are integrally encapsulated with an encapsulating resin. A transistor disposed on an upper surface of the circuit board and a control element mounted on an upper surface of the control board are also covered by the encapsulating resin. Thus, a module in which an inverter circuit and a control circuit are integrally encapsulated with resin is provided.

摘要翻译： 在混合集成电路装置中，以重叠的方式配置其上固定安装引线的岛部的电路板和安装有控制元件等的控制基板。 电路板和控制板与封装树脂一体封装。 设置在电路板的上表面上的晶体管和安装在控制板的上表面上的控制元件也被封装树脂覆盖。 因此，提供了其中逆变器电路和控制电路与树脂一体封装的模块。

公开(公告)号：US09275930B2

公开(公告)日：2016-03-01

申请号：US13242202

申请日：2011-09-23

申请人： Shigeki Mashimo ,  Fumio Horiuchi ,  Kiyoaki Kudo ,  Akira Sakurai ,  Yuhki Inagaki

发明人： Shigeki Mashimo ,  Fumio Horiuchi ,  Kiyoaki Kudo ,  Akira Sakurai ,  Yuhki Inagaki

IPC分类号： H05K7/00 ,  H01L23/433 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L25/07 ,  H01L23/00

CPC分类号： H02M7/537 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/20753 ,  H05K1/0203 ,  H05K1/181 ,  Y10T29/4916 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00012

摘要： In a hybrid integrated circuit device of the present invention, leads are fixedly attached on the upper surface of a circuit board. The lead includes an island portion, a slope portion, and a lead portion. A transistor and a diode are mounted on the upper surface of the island portion. Electrodes provided on the upper surfaces of the transistor and the diode are connected to a bonding portion through a fine metal wire. The bonding portion of the lead is disposed at a higher position than the island portion. Thus, the fine metal wires connected to the bonding portion are separated from each other.

摘要翻译： 在本发明的混合集成电路装置中，引线固定在电路板的上表面上。 引线包括岛部分，斜坡部分和引线部分。 晶体管和二极管安装在岛部的上表面上。 设置在晶体管和二极管的上表面上的电极通过细金属线连接到接合部分。 引线的接合部分设置在比岛部更高的位置。 因此，与接合部连接的细金属线彼此分离。

公开(公告)号：US20120074552A1

公开(公告)日：2012-03-29

申请号：US13240870

申请日：2011-09-22

申请人： Shigeki Mashimo ,  Fumio Horiuchi ,  Kiyoaki Kudo ,  Akira Sakurai ,  Yuhki Inagaki

发明人： Shigeki Mashimo ,  Fumio Horiuchi ,  Kiyoaki Kudo ,  Akira Sakurai ,  Yuhki Inagaki

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49531 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48095 ,  H01L2224/85399 ,  H01L2224/05599

摘要： In a hybrid integrated circuit device, a circuit board on which an island portion of a lead is fixedly attached and a control board on which a control element and the like are mounted are disposed in an overlapping manner. The circuit board and the control board are integrally encapsulated with an encapsulating resin. A transistor disposed on an upper surface of the circuit board and a control element mounted on an upper surface of the control board are also covered by the encapsulating resin. Thus, a module in which an inverter circuit and a control circuit are integrally encapsulated with resin is provided.

摘要翻译： 在混合集成电路装置中，以重叠的方式配置其上固定安装引线的岛部的电路板和安装有控制元件等的控制基板。 电路板和控制板与封装树脂一体封装。 设置在电路板的上表面上的晶体管和安装在控制板的上表面上的控制元件也被封装树脂覆盖。 因此，提供了其中逆变器电路和控制电路与树脂一体封装的模块。

公开(公告)号：US08305001B2

公开(公告)日：2012-11-06

申请号：US12840975

申请日：2010-07-21

申请人： Fumio Horiuchi ,  Toru Imaizumi ,  Takaya Kusabe

发明人： Fumio Horiuchi ,  Toru Imaizumi ,  Takaya Kusabe

IPC分类号： H05B37/02 ,  H02M3/335

CPC分类号： H05B33/0815

摘要： A light-emitting diode driver circuit includes: a first-rectifier circuit to output a first-rectified voltage; a transformer including primary and secondary coils and an auxiliary coil inductively coupled to the primary or secondary coils, the primary coil being applied with the first-rectified voltage; a transistor connected in series to the primary coil; a second-rectifier circuit to output a second-rectified voltage obtained by rectifying a voltage generated in the auxiliary coil; a capacitor to be charged with the second-rectified voltage; and a control circuit to control on and off of the transistor based on a charging voltage of the capacitor so that the charging voltage becomes equal to a predetermined voltage, the secondary coil outputting a voltage that varies with a frequency corresponding to a frequency of the first-rectified voltage and that corresponds to a turns ratio between the primary and secondary coils, as a voltage for driving a light-emitting diode.

摘要翻译： 发光二极管驱动电路包括：第一整流电路，用于输出第一整流电压; 包括初级线圈和次级线圈的变压器和感应耦合到初级或次级线圈的辅助线圈，初级线圈被施加第一整流电压; 与初级线圈串联连接的晶体管; 输出通过对在辅助线圈中产生的电压进行整流而得到的二次整流电压的二次整流电路; 用二次整流电压充电的电容器; 以及控制电路，用于基于所述电容器的充电电压来控制所述晶体管的导通和截止，使得所述充电电压变得等于预定电压，所述次级线圈输出以对应于所述第一电压的频率的频率变化的电压 并且其对应于初级和次级线圈之间的匝数比，作为用于驱动发光二极管的电压。

公开(公告)号：US20110025225A1

公开(公告)日：2011-02-03

申请号：US12840975

申请日：2010-07-21

申请人： Fumio Horiuchi ,  Toru Imaizumi ,  Takaya Kusabe

发明人： Fumio Horiuchi ,  Toru Imaizumi ,  Takaya Kusabe

IPC分类号： H05B37/02

CPC分类号： H05B33/0815

摘要： A light-emitting diode driver circuit includes: a first-rectifier circuit to output a first-rectified voltage; a transformer including primary and secondary coils and an auxiliary coil inductively coupled to the primary or secondary coils, the primary coil being applied with the first-rectified voltage; a transistor connected in series to the primary coil; a second-rectifier circuit to output a second-rectified voltage obtained by rectifying a voltage generated in the auxiliary coil; a capacitor to be charged with the second-rectified voltage; and a control circuit to control on and off of the transistor based on a charging voltage of the capacitor so that the charging voltage becomes equal to a predetermined voltage, the secondary coil outputting a voltage that varies with a frequency corresponding to a frequency of the first-rectified voltage and that corresponds to a turns ratio between the primary and secondary coils, as a voltage for driving a light-emitting diode.

摘要翻译： 发光二极管驱动电路包括：第一整流电路，用于输出第一整流电压; 包括初级线圈和次级线圈的变压器和感应耦合到初级或次级线圈的辅助线圈，初级线圈被施加第一整流电压; 与初级线圈串联连接的晶体管; 输出通过对在辅助线圈中产生的电压进行整流而得到的二次整流电压的二次整流电路; 用二次整流电压充电的电容器; 以及控制电路，用于基于所述电容器的充电电压来控制所述晶体管的导通和截止，使得所述充电电压变得等于预定电压，所述次级线圈输出以对应于所述第一电压的频率的频率变化的电压 并且其对应于初级和次级线圈之间的匝数比，作为用于驱动发光二极管的电压。