发明授权
- 专利标题： Semiconductor device mounted structure and its manufacturing method
- 专利标题（中）： 半导体器件安装结构及其制造方法
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申请号： US13000391申请日： 2009-10-27
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公开(公告)号： US08450859B2公开(公告)日： 2013-05-28
- 发明人: Naomichi Ohashi , Shigeaki Sakatani , Arata Kishi , Atsushi Yamaguchi , Hidenori Miyakawa
- 申请人： Naomichi Ohashi , Shigeaki Sakatani , Arata Kishi , Atsushi Yamaguchi , Hidenori Miyakawa
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2008-275109 20081027
- 国际申请： PCT/JP2009/005662 WO 20091027
- 国际公布： WO2010/050185 WO 20100506
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A semiconductor device mounted structure includes a semiconductor device having a plurality of first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.
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