发明授权
US08455302B2 Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
有权
用于半导体背面的切割带集成膜，以及用于制造半导体器件的工艺
- 专利标题： Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
- 专利标题（中）： 用于半导体背面的切割带集成膜，以及用于制造半导体器件的工艺
-
申请号： US13558540申请日： 2012-07-26
-
公开(公告)号： US08455302B2公开(公告)日： 2013-06-04
- 发明人: Goji Shiga , Naohide Takamoto , Fumiteru Asai
- 申请人： Goji Shiga , Naohide Takamoto , Fumiteru Asai
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2010-170933 20100729
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
The present invention relates to a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer laminated in this order, and a film for semiconductor back surface provided on the pressure-sensitive adhesive layer of the dicing tape, where the pressure-sensitive adhesive layer has a thickness of from 20 μm to 40 μm.
公开/授权文献
信息查询
IPC分类:
