Invention Grant
- Patent Title: Methods and apparatus for assembling and operating electronic device manufacturing systems
- Patent Title (中): 组装和操作电子设备制造系统的方法和装置
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Application No.: US12126922Application Date: 2008-05-25
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Publication No.: US08455368B2Publication Date: 2013-06-04
- Inventor: Phil Chandler , Daniel O. Clark , Robbert M. Vermeulen , Jay J. Jung , Roger M. Johnson , Youssef A. Loldj , James L. Smith
- Applicant: Phil Chandler , Daniel O. Clark , Robbert M. Vermeulen , Jay J. Jung , Roger M. Johnson , Youssef A. Loldj , James L. Smith
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Dugan & Dugan, PC
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for operating one or more electronic device manufacturing systems is provided, including the steps 1) performing a series of electronic device manufacturing process steps with a process tool, wherein the process tool produces effluent as a byproduct of performing the series of process steps; 2) abating the effluent with an abatement tool; 3) supplying an abatement resource to the abatement tool from a first abatement resource supply; 4) changing an abatement resource supply from the first abatement resource supply to a second abatement resource supply, wherein changing the abatement resource supply comprises: i) interrupting a flow of the abatement resource from the first abatement resource supply; and ii) beginning a flow of the abatement resource from the second abatement resource supply; and 5) continuing to perform the series of process steps with the process tool, while changing, and after changing, the abatement resource supply.
Public/Granted literature
- US20080289167A1 METHODS AND APPARATUS FOR ASSEMBLING AND OPERATING ELECTRONIC DEVICE MANUFACTURING SYSTEMS Public/Granted day:2008-11-27
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