Invention Grant
- Patent Title: Multi-chassis interconnect
- Patent Title (中): 多机箱互连
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Application No.: US11426576Application Date: 2006-06-26
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Publication No.: US08457017B2Publication Date: 2013-06-04
- Inventor: Biao Lu , Vinay Ravuri , How Tung Lim , Kamran Farshchi , Yatindra Chugh , Sharfuddin Syed
- Applicant: Biao Lu , Vinay Ravuri , How Tung Lim , Kamran Farshchi , Yatindra Chugh , Sharfuddin Syed
- Applicant Address: US CA Sunnyvale
- Assignee: Infinera Corporation
- Current Assignee: Infinera Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: North, Weber & Baugh LLP
- Agent David L. Soltz
- Main IPC: H04L12/28
- IPC: H04L12/28
Abstract:
The present invention provides a system, apparatus and method for providing point-to-point inter-chassis connections within chassis systems and/or network nodes. Multi-chassis systems within a network employ a protocol wherein a peer discovery process is initiated and the discovered neighbors are authentically verified before establishing an active state between point-to-point inter-chassis links.
Public/Granted literature
- US20070005968A1 MULTI-CHASSIS INTERCONNECT Public/Granted day:2007-01-04
Information query
