Invention Grant
- Patent Title: Electrically conductive composition and fabrication method thereof
- Patent Title (中): 导电组合物及其制造方法
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Application No.: US12813749Application Date: 2010-06-11
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Publication No.: US08465677B2Publication Date: 2013-06-18
- Inventor: Chun-An Lu , Hong-Ching Lin
- Applicant: Chun-An Lu , Hong-Ching Lin
- Applicant Address: TW Hsinchu County
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu County
- Agency: Pai Patent & Trademark Law Firm
- Agent Chao-Chang David Pai
- Priority: TW98137073A 20091102
- Main IPC: H01B1/00
- IPC: H01B1/00 ; H01B1/02 ; H01B1/12 ; H01B1/22 ; B05D5/12

Abstract:
An electrically conductive composition and a fabrication method thereof are provided. The electrically conductive structure includes a major conductive material and an electrically conductive filler of an energy delivery character dispersed around the major conductive material. The method includes mixing a major conductive material with an electrically conductive filler of an energy delivery character to form a mixture, coating the mixture on a substrate, applying a second energy source to the mixture while simultaneously applying a first energy source for sintering the major conductive material to form an electrically conductive composition with a resistivity smaller than 10×10−3Ω·cm.
Public/Granted literature
- US20110101283A1 ELECTRICALLY CONDUCTIVE COMPOSITION AND FABRICATION METHOD THEREOF Public/Granted day:2011-05-05
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