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公开(公告)号：US08911821B2
公开(公告)日：2014-12-16
申请号：US12563419
申请日：2009-09-21
Applicant: Chun-An Lu , Hong-Ching Lin , Kuo-Chan Chiou , Szu-Po Huang
Inventor： Chun-An Lu , Hong-Ching Lin , Kuo-Chan Chiou , Szu-Po Huang
CPC classification number: B22F9/30 , B22F1/025 , B22F2998/00 , C01G1/02 , C01P2002/72 , C01P2006/40 , C09D11/52 , B22F2301/10 , B22F2301/052 , B22F2301/15 , B22F2301/25 , B22F2301/205 , B22F2301/30 , B22F2301/35
Abstract: A method for forming nanometer scale dot-shaped materials is provided. The method includes providing a sub-micrometer scale material and a metallo-organic compound. The sub-micrometer scale material and the metallo-organic compound are mixed in a solvent. Then, the metallo-organic compound is decomposed by thermal decomposition process and reduced to form a plurality of nanometer scale dot-shaped materials on the sub-micrometer scale material, wherein the sub-micrometer scale material and the nanometer-scale dot-shaped materials are heterologous materials. Then, the plurality of nanometer scale dot-shaped materials is melted, such that a plurality of the adjacent sub-micrometer scale materials is connected to each other to form a continuous interface between the sub-micrometer scale materials.
Abstract translation: 提供了形成纳米级点状材料的方法。 该方法包括提供亚微米级材料和金属有机化合物。 亚微米级材料和金属有机化合物在溶剂中混合。 然后，金属有机化合物通过热分解过程分解，并在亚微米级材料上还原形成多个纳米级点状材料，其中亚微米级材料和纳米级点状材料 是异源材料。 然后，使多个纳米级点状材料熔化，使得多个相邻的亚微米级材料彼此连接，以形成亚微米级材料之间的连续界面。
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公开(公告)号：US08465677B2
公开(公告)日：2013-06-18
申请号：US12813749
申请日：2010-06-11
Applicant: Chun-An Lu , Hong-Ching Lin
Inventor： Chun-An Lu , Hong-Ching Lin
CPC classification number: H01B1/22 , C08K9/04 , C09D5/24 , C09D7/62 , C09D7/70 , C09D11/52 , H01B1/24
Abstract: An electrically conductive composition and a fabrication method thereof are provided. The electrically conductive structure includes a major conductive material and an electrically conductive filler of an energy delivery character dispersed around the major conductive material. The method includes mixing a major conductive material with an electrically conductive filler of an energy delivery character to form a mixture, coating the mixture on a substrate, applying a second energy source to the mixture while simultaneously applying a first energy source for sintering the major conductive material to form an electrically conductive composition with a resistivity smaller than 10×10−3Ω·cm.
Abstract translation: 提供导电组合物及其制造方法。 导电结构包括主要导电材料和分散在主要导电材料周围的能量输送特性的导电填料。 该方法包括将主要导电材料与能量输送特性的导电填料混合以形成混合物，将混合物涂覆在基底上，向混合物施加第二能量源，同时施加第一能量来烧结主导电 材料以形成电阻率小于10×10-3Omega·cm的导电组合物。
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3.发明申请RADIO FREQUENCY IDENTIFICATION TAG AND DIAPER, ABSORBER AND SENSING SYSTEM USING THE SAME 有权无线电频率识别标签和DIAPER，吸收和感应系统公开(公告)号：US20130123726A1
公开(公告)日：2013-05-16
申请号：US13524192
申请日：2012-06-15
Applicant: Jiun-Jang Yu , Chiung-Hsiung Chen , Chun-An Lu , Hong-Ching Lin
Inventor： Jiun-Jang Yu , Chiung-Hsiung Chen , Chun-An Lu , Hong-Ching Lin
IPC: A61F13/42 , G06K19/077
CPC classification number: H01Q1/2225 , H01Q1/273 , H01Q9/285
Abstract: A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.
Abstract translation: 提供了包括基板，平面天线，RF芯片，多个信号导体和多个接地导体的射频（RF）识别标签。 RF芯片从平面天线接收RF信号以产生识别码。 信号导体耦合到平面天线。 在信号导体的两个相对侧交织的接地导体和信号导体彼此相邻并且设置在基板上以形成包括阻抗匹配部分和透射部分的共面波导结构。 阻抗匹配部分具有耦合到信号导体的输入端和耦合到接地导体的接地平面。 RF芯片设置在输入端和接地平面之间。 传输部分连接在阻抗匹配部分和平面天线之间。
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4.发明申请NANO-METAL SOLUTION, NANO-METAL COMPLEX GRAINS AND MANUFACTURING METHOD OF METAL FILM 审中-公开纳米金属溶液，纳米金属复合颗粒和金属膜的制造方法公开(公告)号：US20100166952A1
公开(公告)日：2010-07-01
申请号：US12651207
申请日：2009-12-31
Applicant: Kuo-Chan Chiou , Hong-Ching Lin , Szu-Po Huang , Chun-An Lu
Inventor： Kuo-Chan Chiou , Hong-Ching Lin , Szu-Po Huang , Chun-An Lu
CPC classification number: C09D7/61 , B22F1/0022 , B22F7/04 , B22F2998/10 , B82Y30/00 , C08K3/08 , C08K9/02 , C09D1/00 , C09D7/62 , C09D7/67 , B22F9/24 , B22F9/305
Abstract: A nano-metal solution, nano-metal complex grains, and a manufacturing method of a metal film are provided. The nano-metal solution includes metal grains having an amount of 0.1˜30 wt %, metallic-organic self-decomposition molecules having an amount of 0.1˜50 wt % and having formula 1, and a solvent having an amount of 20˜99.8 wt %: wherein M represents a metal ion. The metallic-organic self-decomposition molecules and the metal grains are evenly mixed in the solvent, and the metallic-organic self-decomposition molecules are adsorbed on surfaces of the metal grains.
Abstract translation: 提供纳米金属溶液，纳米金属络合物颗粒和金属膜的制造方法。 纳米金属溶液包含0.1〜30重量％的金属颗粒，0.1〜50重量％的金属有机自分解分子，具有式1的溶剂和20〜99.8重量％的溶剂 ％：其中M表示金属离子。 金属有机自分解分子和金属颗粒在溶剂中均匀混合，金属有机自分解分子被吸附在金属颗粒的表面上。
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公开(公告)号：US20110101283A1
公开(公告)日：2011-05-05
申请号：US12813749
申请日：2010-06-11
Applicant: Chun-An Lu , Hong-Ching Lin
Inventor： Chun-An Lu , Hong-Ching Lin
CPC classification number: H01B1/22 , C08K9/04 , C09D5/24 , C09D7/62 , C09D7/70 , C09D11/52 , H01B1/24
Abstract: An electrically conductive composition and a fabrication method thereof are provided. The electrically conductive structure includes a major conductive material and an electrically conductive filler of an energy delivery character dispersed around the major conductive material. The method includes mixing a major conductive material with an electrically conductive filler of an energy delivery character to form a mixture, coating the mixture on a substrate, applying a second energy source to the mixture while simultaneously applying a first energy source for sintering the major conductive material to form an electrically conductive composition with a resistivity smaller than 10×10−3Ω·cm.
Abstract translation: 提供导电组合物及其制造方法。 导电结构包括主要导电材料和分散在主要导电材料周围的能量输送特性的导电填料。 该方法包括将主要导电材料与能量输送特性的导电填料混合以形成混合物，将混合物涂覆在基底上，向混合物施加第二能量源，同时施加第一能量来烧结主导电 材料以形成电阻率小于10×10-3＆OHgr·cm的导电组合物。
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Patent Agency Ranking
6.发明授权Radio frequency identification tag and diaper, absorber and sensing system using the same 有权射频识别标签和尿布，吸收器和感应系统使用相同公开(公告)号：US09160054B2
公开(公告)日：2015-10-13
申请号：US13524192
申请日：2012-06-15
Applicant: Jiun-Jang Yu , Chiung-Hsiung Chen , Chun-An Lu , Hong-Ching Lin
Inventor： Jiun-Jang Yu , Chiung-Hsiung Chen , Chun-An Lu , Hong-Ching Lin
CPC classification number: H01Q1/2225 , H01Q1/273 , H01Q9/285
Abstract: A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.
Abstract translation: 提供了包括基板，平面天线，RF芯片，多个信号导体和多个接地导体的射频（RF）识别标签。 RF芯片从平面天线接收RF信号以产生识别码。 信号导体耦合到平面天线。 在信号导体的两个相对侧交织的接地导体和信号导体彼此相邻并且设置在基板上以形成包括阻抗匹配部分和透射部分的共面波导结构。 阻抗匹配部分具有耦合到信号导体的输入端和耦合到接地导体的接地平面。 RF芯片设置在输入端和接地平面之间。 传输部分连接在阻抗匹配部分和平面天线之间。
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公开(公告)号：US20130044401A1
公开(公告)日：2013-02-21
申请号：US13587005
申请日：2012-08-16
Applicant: Hsin-Hsien Yeh , Hong-Ching Lin , Tsung-Wen Chen , Wen-Hao Deng
Inventor： Hsin-Hsien Yeh , Hong-Ching Lin , Tsung-Wen Chen , Wen-Hao Deng
CPC classification number: H02H3/202 , H01H85/0039 , H01H85/10 , H01H85/12 , H01M10/446 , H01M10/486 , H02H7/18
Abstract: A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.
Abstract translation: 保护部件包括：封装基板; 布置在所述封装衬底中的第一熔丝单元，具有第一熔化区域; 设置在所述封装基板中的第二熔丝单元，具有靠近所述第一熔融区域的第二熔融区域; 以及设置在与第一和第二熔融区域相对应的封装衬底中的第一掩埋洞穴。 当第一熔融区域和第二熔融区域中的一个被吹出时，第一掩埋洞穴帮助熔丝熔化的能量破坏第一和第二熔化区域中的另一个。
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公开(公告)号：US20090160653A1
公开(公告)日：2009-06-25
申请号：US12003615
申请日：2007-12-28
Applicant: Hsin-Hsien Yeh , Ying-Chang Hung , Jiun-Jang Yu , Hong-Ching Lin , Chiung-Hsiung Chen
Inventor： Hsin-Hsien Yeh , Ying-Chang Hung , Jiun-Jang Yu , Hong-Ching Lin , Chiung-Hsiung Chen
IPC: G08B1/00
CPC classification number: G06K19/07749 , G06K19/07771 , H01Q1/2208 , H01Q7/00
Abstract: An anti-metal radio frequency identification (RFID) tag and a manufacturing method thereof are described. The anti-metal RFID tag includes a substrate having a first surface and a second surface on an opposite side thereof; a planar integral antenna formed on the first surface of the substrate; a RFID transceiver chip (i.e., RFID chip) disposed on the surface of the substrate and coupled to a signal feed point of the planar integral antenna. The flexible planar integral antenna and substrate are folded and then fixed by a fixing mechanism to form an anti-metal RFID tag with a feed-in structure, a RFID transceiver chip, and a radiator on one side, and a ground plane on the opposite side. A spacer is further sandwiched in the center of the folded structure, which is helpful for improving the antenna gain of the anti-metal RFID tag.
Abstract translation: 描述了一种反金属射频识别（RFID）标签及其制造方法。 所述反金属RFID标签包括具有第一表面和在其相对侧上的第二表面的基板; 形成在所述基板的第一表面上的平面集成天线; RFID收发器芯片（即，RFID芯片），其布置在基板的表面上并且耦合到平面一体式天线的信号馈送点。 柔性平面一体化天线和基板被折叠然后通过固定机构固定，以形成具有馈入结构的反金属RFID标签，RFID收发器芯片和一侧的散热器，以及相对的接地平面 侧。 间隔件进一步夹在折叠结构的中心，这有助于提高反金属RFID标签的天线增益。
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公开(公告)号：US20050142839A1
公开(公告)日：2005-06-30
申请号：US11002509
申请日：2004-12-02
Applicant: Ying-Chang Houng , Hong-Ching Lin , Chi-Jen Shih , Shao-Ju Shih
Inventor： Ying-Chang Houng , Hong-Ching Lin , Chi-Jen Shih , Shao-Ju Shih
CPC classification number: C23C18/06 , C23C18/08 , H05K1/097 , H05K3/105 , Y10T428/256
Abstract: Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (
Abstract translation: 形成导电层的方法。 将金属复合材料层施加在基板上，包括多个金属薄片，多个纳米金属球体和多个混合金属前体。 多种混合金属前体包括无机盐和有机酸性盐的混合物。 金属复合材料层被固化以引起放热反应，从而在相对低的温度（<200℃）下在基板上形成导电层，
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公开(公告)号：US07821136B2
公开(公告)日：2010-10-26
申请号：US11552534
申请日：2006-10-25
Applicant: Ying-Chang Houng , Hong-Ching Lin , Chi-Jen Shih , Shao-Ju Shih
Inventor： Ying-Chang Houng , Hong-Ching Lin , Chi-Jen Shih , Shao-Ju Shih
CPC classification number: C23C18/06 , C23C18/08 , H05K1/097 , H05K3/105 , Y10T428/256
Abstract: Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (
Abstract translation: 形成导电层的方法。 将金属复合材料层施加在基板上，包括多个金属薄片，多个纳米金属球体和多个混合金属前体。 多种混合金属前体包括无机盐和有机酸性盐的混合物。 固化该金属复合层以引起放热反应，从而在较低温度（<200℃）下在基板上形成导电层。
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