- 专利标题: Cathode unit and sputtering apparatus provided with the same
- 专利标题(中): 阴极单元和溅射装置
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申请号: US12991777申请日: 2009-06-23
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公开(公告)号: US08470145B2公开(公告)日: 2013-06-25
- 发明人: Naoki Morimoto , Tomoyasu Kondo , Daisuke Mori , Kyuzo Nakamura
- 申请人: Naoki Morimoto , Tomoyasu Kondo , Daisuke Mori , Kyuzo Nakamura
- 申请人地址: JP Kanagawa
- 专利权人: Ulvac, Inc.
- 当前专利权人: Ulvac, Inc.
- 当前专利权人地址: JP Kanagawa
- 代理机构: Cermak Nakajima LLP
- 代理商 Tomoko Nakajima
- 优先权: JP2008-167175 20080626
- 国际申请: PCT/JP2009/061397 WO 20090623
- 国际公布: WO2009/157438 WO 20091230
- 主分类号: C23C14/35
- IPC分类号: C23C14/35
摘要:
There is provided an inexpensive cathode unit which is simple in construction and is capable of forming a film at good coating characteristics relative to each of micropores of high aspect ratio throughout an entire surface of a substrate. There is also provided a sputtering apparatus provided with the cathode unit. The cathode unit of this invention has a holder formed with one or more recessed portions on one surface thereof. Inside the recessed portions there are mounted bottomed cylindrical target members from the bottom side thereof. Into a space inside each of the target members there are built magnetic field generating means for generating magnetic fields.
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