Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13466565Application Date: 2012-05-08
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Publication No.: US08476677B2Publication Date: 2013-07-02
- Inventor: Osamu Machida , Akio Iwabuchi
- Applicant: Osamu Machida , Akio Iwabuchi
- Applicant Address: JP Niiza-shi
- Assignee: Sanken Electric Co., Ltd.
- Current Assignee: Sanken Electric Co., Ltd.
- Current Assignee Address: JP Niiza-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-325409 20081222
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
An aspect of the present invention inheres in a semiconductor device includes a semiconductor region, a source electrode and a drain electrode, which are provided on a main surface of the semiconductor region, a gate electrode exhibiting normally-off characteristics, the gate electrode being provided above the main surface of the semiconductor region while interposing a p-type material film therebetween, and being arranged between the source electrode and the drain electrode, and a fourth electrode that is provided on the main surface of the semiconductor region, and is arranged between the gate electrode and the drain electrode.
Public/Granted literature
- US20120217546A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-08-30
Information query
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