Invention Grant
US08482084B2 SOI schottky source/drain device structure to control encroachment and delamination of silicide
失效
SOI肖特基源/漏极器件结构,以控制硅化物的侵蚀和分层
- Patent Title: SOI schottky source/drain device structure to control encroachment and delamination of silicide
- Patent Title (中): SOI肖特基源/漏极器件结构,以控制硅化物的侵蚀和分层
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Application No.: US12726789Application Date: 2010-03-18
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Publication No.: US08482084B2Publication Date: 2013-07-09
- Inventor: Marwan H. Khater , Christian Lavoie , Bin Yang , Zhen Zhang
- Applicant: Marwan H. Khater , Christian Lavoie , Bin Yang , Zhen Zhang
- Applicant Address: US NY Armonk KY Grand Cayman
- Assignee: International Business Machines Corporation,Global Foundries, Inc.
- Current Assignee: International Business Machines Corporation,Global Foundries, Inc.
- Current Assignee Address: US NY Armonk KY Grand Cayman
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L31/00

Abstract:
A Schottky field effect transistor is provided that includes a substrate having a layer of semiconductor material atop a dielectric layer, wherein the layer of semiconductor material has a thickness of less than 10.0 nm. A gate structure is present on the layer of semiconductor material. Raised source and drain regions comprised of a metal semiconductor alloy are present on the layer of semiconductor material on opposing sides of the gate structure. The raised source and drain regions are Schottky source and drain regions. In one embodiment, a first portion of the Schottky source and drain regions that is adjacent to a channel region of the Schottky field effect transistor contacts the dielectric layer, and a non-reacted semiconductor material is present between a second portion of the Schottky source and drain regions and the dielectric layer.
Public/Granted literature
- US20110227156A1 SOI Schottky Source/Drain Device Structure to Control Encroachment and Delamination of Silicide Public/Granted day:2011-09-22
Information query
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