发明授权
US08482890B2 PCB strip and manufacturing method for electronic component embedded PCB
失效
电子元件嵌入式PCB的PCB板和制造方法
- 专利标题： PCB strip and manufacturing method for electronic component embedded PCB
- 专利标题（中）： 电子元件嵌入式PCB的PCB板和制造方法
-
申请号： US12821651申请日： 2010-06-23
-
公开(公告)号： US08482890B2公开(公告)日： 2013-07-09
- 发明人: Moon-il Kim , Yul-Kyo Chung , Hwa-Sun Park
- 申请人： Moon-il Kim , Yul-Kyo Chung , Hwa-Sun Park
- 申请人地址： KR Gyunggi-Do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Gyunggi-Do
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2010-0004876 20100119
- 主分类号： H02H3/22
- IPC分类号： H02H3/22
摘要：
A PCB strip and a method of manufacturing an electronic component embedded printed circuit board are disclosed. The PCB strip in accordance with an embodiment of the present invention includes a unit area, which has a plurality of substrate units provided therein, and a dummy area, which is provided on an outer side of the unit area. Here, an electronic component can be embedded in the substrate unit, and an electrostatic discharge preventing component for protecting the electronic component from an electrostatic discharge can be embedded in the dummy area.