公开(公告)号：US08633397B2

公开(公告)日：2014-01-21

申请号：US12860301

申请日：2010-08-20

申请人： Jin-Soo Jeong ,  Doo-hwan Lee ,  Hwa-Sun Park ,  Jae-Kul Lee ,  Yul-Kyo Chung

发明人： Jin-Soo Jeong ,  Doo-hwan Lee ,  Hwa-Sun Park ,  Jae-Kul Lee ,  Yul-Kyo Chung

IPC分类号： H05K1/16

CPC分类号： H05K3/007 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/0554 ,  H05K2203/1572 ,  Y10T29/49124 ,  H01L2924/00

摘要： A method of processing a cavity of a core substrate is disclosed. The method of processing a cavity of a core substrate in accordance with an embodiment of the present invention can include: forming a first processing area on one surface of a core substrate, the first processing area being demarcated by a circuit pattern; forming a second processing area on the other surface of the core substrate, the second processing area being demarcated by a circuit pattern; and processing a cavity by removing the entire first processing area from the one surface of the core substrate.

摘要翻译： 公开了一种处理芯基板的空腔的方法。 根据本发明的实施例的处理芯基板的空腔的方法可以包括：在芯基板的一个表面上形成第一处理区域，第一处理区域由电路图案划定; 在所述芯基板的另一表面上形成第二处理区域，所述第二处理区域由电路图案划定; 以及通过从芯基板的一个表面去除整个第一处理区域来处理空腔。

公开(公告)号：US08618421B2

公开(公告)日：2013-12-31

申请号：US12915707

申请日：2010-10-29

申请人： Jung-Soo Byun ,  Yul-Kyo Chung ,  Hwa-Sun Park ,  Kyung-Min Lee ,  Mike Kim ,  Doo-hwan Lee

发明人： Jung-Soo Byun ,  Yul-Kyo Chung ,  Hwa-Sun Park ,  Kyung-Min Lee ,  Mike Kim ,  Doo-hwan Lee

IPC分类号： H05K1/16

CPC分类号： H01L23/5389 ,  H01L23/3121 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10674 ,  H01L2924/00

摘要： An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.

摘要翻译： 公开了一种电子部件嵌入式印刷电路板。 根据本发明的实施例，电子部件嵌入式印刷电路板是其中电子部件嵌入在核心板中的印刷电路板，并且电子部件包括形成的硅层和钝化层 在硅层的一个表面上。 这里，将硅层的中心线和芯板的中心线放置在同一条线上。

公开(公告)号：US20110100689A1

公开(公告)日：2011-05-05

申请号：US12915707

申请日：2010-10-29

申请人： Jung-Soo BYUN ,  Yul-Kyo Chung ,  Hwa-Sun Park ,  Kyung-Min Lee ,  Mike Kim ,  Doo-Hwan Lee

发明人： Jung-Soo BYUN ,  Yul-Kyo Chung ,  Hwa-Sun Park ,  Kyung-Min Lee ,  Mike Kim ,  Doo-Hwan Lee

IPC分类号： H05K1/16 ,  H05K1/00

CPC分类号： H01L23/5389 ,  H01L23/3121 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10674 ,  H01L2924/00

摘要： An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.

摘要翻译： 公开了一种电子部件嵌入式印刷电路板。 根据本发明的实施例，电子部件嵌入式印刷电路板是其中电子部件嵌入在核心板中的印刷电路板，并且电子部件包括形成的硅层和钝化层 在硅层的一个表面上。 这里，将硅层的中心线和芯板的中心线放置在同一条线上。

公开(公告)号：US20110099779A1

公开(公告)日：2011-05-05

申请号：US12929234

申请日：2011-01-10

申请人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Hong-Won Kim ,  Dae-Jun Kim ,  Jin-Seon Park

发明人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Hong-Won Kim ,  Dae-Jun Kim ,  Jin-Seon Park

IPC分类号： H01G7/00

CPC分类号： H05K1/162 ,  H05K3/108 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2201/09672 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49167

摘要： A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.

摘要翻译： 一种制造电容器嵌入式印刷电路板的方法，其包括制造具有形成在电介质层的一侧上的至少一个内部电极的电容器基板; 将半固化绝缘层与芯层的一侧对准，并将电容器基板与半固化绝缘层对准，使得内电极面向半固化绝缘层; 并且集中地堆叠芯层，半固化绝缘层和电容器基板。

公开(公告)号：US20090244864A1

公开(公告)日：2009-10-01

申请号：US12320794

申请日：2009-02-04

申请人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Sang-Chul Lee ,  Jong-Woo Han ,  Young-Do Kweon

发明人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Sang-Chul Lee ,  Jong-Woo Han ,  Young-Do Kweon

IPC分类号： H05K1/18 ,  B32B7/00 ,  B32B37/02

CPC分类号： H05K1/162 ,  H05K3/108 ,  H05K3/386 ,  H05K3/387 ,  H05K3/4602 ,  H05K3/4626 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09672 ,  Y10T428/24355

摘要： Disclosed are a substrate for a capacitor-embedded printed circuit board, a capacitor-embedded printed circuit board, and a manufacturing method thereof. The capacitor-embedded printed circuit board can include a core board, an insulation resin layer, which is stacked on the core board, a first electrode and a first circuit pattern, which are buried in the insulation resin layer, a dielectric layer, which is stacked on a surface of the insulation resin layer, a first adhesive resin layer, which is stacked on the dielectric layer, and a second electrode and a second circuit pattern, which are formed on a surface of the first adhesive resin layer to correspond with the first electrode. With the present invention, the manufacturing process can be simplified and the reliability of products can be improved by reducing the variation of the capacitor (C).

摘要翻译： 公开了用于电容器嵌入式印刷电路板的基板，电容器嵌入式印刷电路板及其制造方法。 电容器嵌入式印刷电路板可以包括堆叠在芯板上的芯板，绝缘树脂层，埋在绝缘树脂层中的第一电极和第一电路图案，介电层，其是 堆叠在绝缘树脂层的表面上，堆叠在电介质层上的第一粘合树脂层和形成在第一粘合树脂层的表面上的第二电极和第二电路图案，以对应于 第一电极。 利用本发明，可以简化制造工艺，并且可以通过减小电容器（C）的变化来提高产品的可靠性。

公开(公告)号：US20080110669A1

公开(公告)日：2008-05-15

申请号：US11976760

申请日：2007-10-26

申请人： Hwa Sun Park ,  Tae Eui Kim ,  Jong Kuk Hong ,  Sang Jin Baek ,  Hong Won Kim ,  Jin Soo Jeong

发明人： Hwa Sun Park ,  Tae Eui Kim ,  Jong Kuk Hong ,  Sang Jin Baek ,  Hong Won Kim ,  Jin Soo Jeong

IPC分类号： H05K1/16 ,  H05K3/30

CPC分类号： H05K1/167 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4644 ,  H05K2201/09481 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： Disclosed herein is a Printed Circuit Board (PCB) having embedded resistors and a method of manufacturing the same, in which contact pads are formed by filling via holes formed on electrode pads with oxidation-resistant conductive material, and resistors are formed on the contact pads. Accordingly, erosion that occurs between the electrode pads and the resistors can be prevented using the contact pads made of oxidation-resistant conductive material, and connections between circuits also can be realized. Furthermore, resistors are formed on a flat plane without any difference in height, attributable to the electrode pads, and thus differences between the resistance values of the built-in resistors can be greatly reduced.

摘要翻译： 本文公开了具有嵌入式电阻器的印刷电路板（PCB）及其制造方法，其中通过在电极焊盘上形成的具有抗氧化导电材料的孔填充形成接触焊盘，并且在接触焊盘上形成电阻器 。 因此，可以使用由抗氧化导电材料制成的接触垫来防止在电极焊盘和电阻器之间发生的侵蚀，并且还可以实现电路之间的连接。 此外，电阻器形成在平面上，由于电极焊盘而在高度上没有任何差异，因此可以大大降低内置电阻器的电阻值之间的差异。

公开(公告)号：US08482890B2

公开(公告)日：2013-07-09

申请号：US12821651

申请日：2010-06-23

申请人： Moon-il Kim ,  Yul-Kyo Chung ,  Hwa-Sun Park

发明人： Moon-il Kim ,  Yul-Kyo Chung ,  Hwa-Sun Park

IPC分类号： H02H3/22

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L2924/12035 ,  H05K1/0259 ,  H05K3/4602 ,  H05K2201/09972 ,  H05K2203/1461 ,  Y10T156/1002 ,  H01L2924/00

摘要： A PCB strip and a method of manufacturing an electronic component embedded printed circuit board are disclosed. The PCB strip in accordance with an embodiment of the present invention includes a unit area, which has a plurality of substrate units provided therein, and a dummy area, which is provided on an outer side of the unit area. Here, an electronic component can be embedded in the substrate unit, and an electrostatic discharge preventing component for protecting the electronic component from an electrostatic discharge can be embedded in the dummy area.

摘要翻译： 公开了一种PCB板和一种制造电子元件嵌入式印刷电路板的方法。 根据本发明的实施例的PCB板包括设置在其中的多个基板单元的单元区域和设置在单元区域的外侧上的虚拟区域。 这里，可以将电子部件嵌入到基板单元中，并且可以在虚拟区域中嵌入用于保护电子部件免受静电放电的防静电部件。

公开(公告)号：US08302270B2

公开(公告)日：2012-11-06

申请号：US12929234

申请日：2011-01-10

申请人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Hong-Won Kim ,  Dae-Jun Kim ,  Jin-Seon Park

发明人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Hong-Won Kim ,  Dae-Jun Kim ,  Jin-Seon Park

IPC分类号： H01G7/00

CPC分类号： H05K1/162 ,  H05K3/108 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2201/09672 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49167

摘要： A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.

摘要翻译： 一种制造电容器嵌入式印刷电路板的方法，其包括制造具有形成在电介质层的一侧上的至少一个内部电极的电容器基板; 将半固化绝缘层与芯层的一侧对准，并将电容器基板与半固化绝缘层对准，使得内电极面向半固化绝缘层; 并且集中地堆叠芯层，半固化绝缘层和电容器基板。

公开(公告)号：US20110176246A1

公开(公告)日：2011-07-21

申请号：US12821651

申请日：2010-06-23

申请人： Moon-il KIM ,  Yul-Kyo Chung ,  Hwa-Sun Park

发明人： Moon-il KIM ,  Yul-Kyo Chung ,  Hwa-Sun Park

IPC分类号： H02H9/00 ,  B29C65/54 ,  H05K1/18

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L2924/12035 ,  H05K1/0259 ,  H05K3/4602 ,  H05K2201/09972 ,  H05K2203/1461 ,  Y10T156/1002 ,  H01L2924/00

摘要： A PCB strip and a method of manufacturing an electronic component embedded printed circuit board are disclosed. The PCB strip in accordance with an embodiment of the present invention includes a unit area, which has a plurality of substrate units provided therein, and a dummy area, which is provided on an outer side of the unit area. Here, an electronic component can be embedded in the substrate unit, and an electrostatic discharge preventing component for protecting the electronic component from an electrostatic discharge can be embedded in the dummy area.

摘要翻译： 公开了一种PCB板和一种制造电子元件嵌入式印刷电路板的方法。 根据本发明的实施例的PCB板包括设置在其中的多个基板单元的单元区域和设置在单元区域的外侧上的虚拟区域。 这里，可以将电子部件嵌入到基板单元中，并且可以在虚拟区域中嵌入用于保护电子部件免受静电放电的防静电部件。

公开(公告)号：US20100269335A1

公开(公告)日：2010-10-28

申请号：US12801870

申请日：2010-06-29

申请人： Hwa Sun Park ,  Tae Eui Kim

发明人： Hwa Sun Park ,  Tae Eui Kim

IPC分类号： H05K3/10

CPC分类号： H05K1/167 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4644 ,  H05K2201/09481 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of manufacturing a printed circuit board (PCB) having embedded resistors, including providing a PCB on which internal layer circuit patterns, including electrode pads, are formed; layering insulating layers on the PCB; forming first via holes on the electrode pads and simultaneously forming second via holes at predetermined locations on the internal layer circuit patterns; forming contact pads for connecting the electrode pads with resistors by filling the first via holes with oxidation-resistant conductive material and flattening the oxidation-resistant conductive material; forming the resistors so that ends of each resistor are connected to two respective contact pads, which are spaced apart from each other; forming circuit patterns on the PCB, in which the second via holes are formed; and layering insulting layers on the PCB having the formed circuit patterns, and forming external layer circuit patterns.

摘要翻译： 一种具有嵌入式电阻器的印刷电路板（PCB）的制造方法，其特征在于，提供形成有包含电极焊盘的内层电路图案的PCB; 在PCB上分层绝缘层; 在电极焊盘上形成第一通孔并同时在内层电路图形上的预定位置形成第二通孔; 形成用于通过用耐氧化导电材料填充第一通孔并使抗氧化导电材料变平的方式将电极焊盘与电阻器连接的接触焊盘; 形成电阻器，使得每个电阻器的端部连接到彼此间隔开的两个相应的接触焊盘; 在PCB上形成电路图案，其中形成第二通孔; 以及在PCB上具有形成的电路图案的层叠绝缘层，以及形成外部层电路图案。