公开(公告)号：US08482890B2

公开(公告)日：2013-07-09

申请号：US12821651

申请日：2010-06-23

申请人： Moon-il Kim ,  Yul-Kyo Chung ,  Hwa-Sun Park

发明人： Moon-il Kim ,  Yul-Kyo Chung ,  Hwa-Sun Park

IPC分类号： H02H3/22

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L2924/12035 ,  H05K1/0259 ,  H05K3/4602 ,  H05K2201/09972 ,  H05K2203/1461 ,  Y10T156/1002 ,  H01L2924/00

摘要： A PCB strip and a method of manufacturing an electronic component embedded printed circuit board are disclosed. The PCB strip in accordance with an embodiment of the present invention includes a unit area, which has a plurality of substrate units provided therein, and a dummy area, which is provided on an outer side of the unit area. Here, an electronic component can be embedded in the substrate unit, and an electrostatic discharge preventing component for protecting the electronic component from an electrostatic discharge can be embedded in the dummy area.

摘要翻译： 公开了一种PCB板和一种制造电子元件嵌入式印刷电路板的方法。 根据本发明的实施例的PCB板包括设置在其中的多个基板单元的单元区域和设置在单元区域的外侧上的虚拟区域。 这里，可以将电子部件嵌入到基板单元中，并且可以在虚拟区域中嵌入用于保护电子部件免受静电放电的防静电部件。

公开(公告)号：US20110176246A1

公开(公告)日：2011-07-21

申请号：US12821651

申请日：2010-06-23

申请人： Moon-il KIM ,  Yul-Kyo Chung ,  Hwa-Sun Park

发明人： Moon-il KIM ,  Yul-Kyo Chung ,  Hwa-Sun Park

IPC分类号： H02H9/00 ,  B29C65/54 ,  H05K1/18

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L2924/12035 ,  H05K1/0259 ,  H05K3/4602 ,  H05K2201/09972 ,  H05K2203/1461 ,  Y10T156/1002 ,  H01L2924/00

摘要： A PCB strip and a method of manufacturing an electronic component embedded printed circuit board are disclosed. The PCB strip in accordance with an embodiment of the present invention includes a unit area, which has a plurality of substrate units provided therein, and a dummy area, which is provided on an outer side of the unit area. Here, an electronic component can be embedded in the substrate unit, and an electrostatic discharge preventing component for protecting the electronic component from an electrostatic discharge can be embedded in the dummy area.

摘要翻译： 公开了一种PCB板和一种制造电子元件嵌入式印刷电路板的方法。 根据本发明的实施例的PCB板包括设置在其中的多个基板单元的单元区域和设置在单元区域的外侧上的虚拟区域。 这里，可以将电子部件嵌入到基板单元中，并且可以在虚拟区域中嵌入用于保护电子部件免受静电放电的防静电部件。

公开(公告)号：US20110048780A1

公开(公告)日：2011-03-03

申请号：US12860301

申请日：2010-08-20

申请人： Jin-Soo Jeong ,  Doo-hwan Lee ,  Hwa-Sun Park ,  Jae-Kul Lee ,  Yul-Kyo Chung

发明人： Jin-Soo Jeong ,  Doo-hwan Lee ,  Hwa-Sun Park ,  Jae-Kul Lee ,  Yul-Kyo Chung

IPC分类号： H05K1/16 ,  H05K3/10

CPC分类号： H05K3/007 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/0554 ,  H05K2203/1572 ,  Y10T29/49124 ,  H01L2924/00

摘要： A method of processing a cavity of a core substrate is disclosed. The method of processing a cavity of a core substrate in accordance with an embodiment of the present invention can include: forming a first processing area on one surface of a core substrate, the first processing area being demarcated by a circuit pattern; forming a second processing area on the other surface of the core substrate, the second processing area being demarcated by a circuit pattern; and processing a cavity by removing the entire first processing area from the one surface of the core substrate.

摘要翻译： 公开了一种处理芯基板的空腔的方法。 根据本发明的实施例的处理芯基板的空腔的方法可以包括：在芯基板的一个表面上形成第一处理区域，第一处理区域由电路图案划定; 在所述芯基板的另一表面上形成第二处理区域，所述第二处理区域由电路图案划定; 以及通过从芯基板的一个表面去除整个第一处理区域来处理空腔。

公开(公告)号：US07730612B2

公开(公告)日：2010-06-08

申请号：US12081858

申请日：2008-04-22

申请人： Hwa-Sun Park ,  Sung Yi ,  Sang-Chul Lee ,  Jong-Woon Kim ,  Yul-Kyo Chung

发明人： Hwa-Sun Park ,  Sung Yi ,  Sang-Chul Lee ,  Jong-Woon Kim ,  Yul-Kyo Chung

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0969 ,  H05K2203/1469 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first metal layer stacked over a first insulation layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 该方法包括：在第一绝缘层上形成盲孔以使第一绝缘层被暴露，对于包覆层叠在第一绝缘层上的第一金属层的覆金属层压板，将部件固定在第一绝缘层上 将所述部件嵌入所述盲孔中，在所述覆金属层压板的任一侧堆叠第二绝缘层和第二金属层，以及通过去除所述金属层的一部分来形成电路图案。

公开(公告)号：US08633397B2

公开(公告)日：2014-01-21

申请号：US12860301

申请日：2010-08-20

申请人： Jin-Soo Jeong ,  Doo-hwan Lee ,  Hwa-Sun Park ,  Jae-Kul Lee ,  Yul-Kyo Chung

发明人： Jin-Soo Jeong ,  Doo-hwan Lee ,  Hwa-Sun Park ,  Jae-Kul Lee ,  Yul-Kyo Chung

IPC分类号： H05K1/16

CPC分类号： H05K3/007 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/0554 ,  H05K2203/1572 ,  Y10T29/49124 ,  H01L2924/00

摘要： A method of processing a cavity of a core substrate is disclosed. The method of processing a cavity of a core substrate in accordance with an embodiment of the present invention can include: forming a first processing area on one surface of a core substrate, the first processing area being demarcated by a circuit pattern; forming a second processing area on the other surface of the core substrate, the second processing area being demarcated by a circuit pattern; and processing a cavity by removing the entire first processing area from the one surface of the core substrate.

摘要翻译： 公开了一种处理芯基板的空腔的方法。 根据本发明的实施例的处理芯基板的空腔的方法可以包括：在芯基板的一个表面上形成第一处理区域，第一处理区域由电路图案划定; 在所述芯基板的另一表面上形成第二处理区域，所述第二处理区域由电路图案划定; 以及通过从芯基板的一个表面去除整个第一处理区域来处理空腔。

公开(公告)号：US08618421B2

公开(公告)日：2013-12-31

申请号：US12915707

申请日：2010-10-29

申请人： Jung-Soo Byun ,  Yul-Kyo Chung ,  Hwa-Sun Park ,  Kyung-Min Lee ,  Mike Kim ,  Doo-hwan Lee

发明人： Jung-Soo Byun ,  Yul-Kyo Chung ,  Hwa-Sun Park ,  Kyung-Min Lee ,  Mike Kim ,  Doo-hwan Lee

IPC分类号： H05K1/16

CPC分类号： H01L23/5389 ,  H01L23/3121 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10674 ,  H01L2924/00

摘要： An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.

摘要翻译： 公开了一种电子部件嵌入式印刷电路板。 根据本发明的实施例，电子部件嵌入式印刷电路板是其中电子部件嵌入在核心板中的印刷电路板，并且电子部件包括形成的硅层和钝化层 在硅层的一个表面上。 这里，将硅层的中心线和芯板的中心线放置在同一条线上。

公开(公告)号：US20110100689A1

公开(公告)日：2011-05-05

申请号：US12915707

申请日：2010-10-29

申请人： Jung-Soo BYUN ,  Yul-Kyo Chung ,  Hwa-Sun Park ,  Kyung-Min Lee ,  Mike Kim ,  Doo-Hwan Lee

发明人： Jung-Soo BYUN ,  Yul-Kyo Chung ,  Hwa-Sun Park ,  Kyung-Min Lee ,  Mike Kim ,  Doo-Hwan Lee

IPC分类号： H05K1/16 ,  H05K1/00

CPC分类号： H01L23/5389 ,  H01L23/3121 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10674 ,  H01L2924/00

摘要： An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.

摘要翻译： 公开了一种电子部件嵌入式印刷电路板。 根据本发明的实施例，电子部件嵌入式印刷电路板是其中电子部件嵌入在核心板中的印刷电路板，并且电子部件包括形成的硅层和钝化层 在硅层的一个表面上。 这里，将硅层的中心线和芯板的中心线放置在同一条线上。

公开(公告)号：US20100097770A1

公开(公告)日：2010-04-22

申请号：US12406636

申请日：2009-03-18

申请人： Hwa-Sun Park ,  Yul-Kyo Chung ,  Jong-Man Kim ,  One-Cheol Bae

发明人： Hwa-Sun Park ,  Yul-Kyo Chung ,  Jong-Man Kim ,  One-Cheol Bae

IPC分类号： H05K1/16 ,  H05K3/46 ,  H05K3/00 ,  H05K1/00

CPC分类号： H05K1/185 ,  H01L21/6835 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2225/06524 ,  H01L2225/06575 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0269 ,  H05K3/305 ,  H05K3/386 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/09918 ,  H05K2201/10515 ,  H05K2203/063 ,  H05K2203/066 ,  Y10T156/1052

摘要： Disclosed are a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: mounting an electronic device on an upper surface of an adhesive layer; laminating an insulator on an upper side of the electronic device and a lower side of the adhesive layer, respectively, such that the electronic device is buried; and forming a circuit pattern and a via on the insulator.

摘要翻译： 公开了一种印刷电路板及其制造方法。 印刷电路板的制造方法包括：将电子器件安装在粘合剂层的上表面上; 分别在电子设备的上侧和粘合剂层的下侧层叠绝缘体，使得电子器件被埋置; 并在绝缘体上形成电路图案和通孔。

公开(公告)号：US20090049686A1

公开(公告)日：2009-02-26

申请号：US12081858

申请日：2008-04-22

申请人： Hwa-Sun Park ,  Sung Yi ,  Sang-Chul Lee ,  Jong-Woon Kim ,  Yul-Kyo Chung

发明人： Hwa-Sun Park ,  Sung Yi ,  Sang-Chul Lee ,  Jong-Woon Kim ,  Yul-Kyo Chung

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0969 ,  H05K2203/1469 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first insulation layer stacked over a first metal layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 该方法包括：在第一金属层上形成盲孔以使第一绝缘层暴露，对于包覆层叠在第一金属层上的第一绝缘层的覆金属层压板，将部件固定到第一绝缘层上 将所述部件嵌入所述盲孔中，在所述覆金属层压板的任一侧堆叠第二绝缘层和第二金属层，以及通过去除所述金属层的一部分来形成电路图案。

公开(公告)号：US20110116246A1

公开(公告)日：2011-05-19

申请号：US12818497

申请日：2010-06-18

申请人： Jin-Won LEE ,  Yul-Kyo Chung ,  Seung-Hyun Sohn ,  Moon-Il Kim

发明人： Jin-Won LEE ,  Yul-Kyo Chung ,  Seung-Hyun Sohn ,  Moon-Il Kim

IPC分类号： H05K1/18 ,  B32B37/02

CPC分类号： H05K1/18 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/73267 ,  H05K3/30 ,  H05K3/46 ,  Y10T29/49146 ,  Y10T156/10

摘要： An electronic component embedded printed circuit board and a method of manufacturing the same are disclosed. The electronic component embedded printed circuit board in accordance with an embodiment of the present invention can include a first substrate, which has a cavity formed therein, a first electronic component, which is embedded in the cavity in a face-down manner, a second electronic component, which is stacked on an upper side of the first electronic component and embedded in the cavity in a face-up manner, and a second substrate, which is stacked on upper and lower surfaces of the first substrate.

摘要翻译： 公开了电子部件嵌入式印刷电路板及其制造方法。 根据本发明的实施例的电子部件嵌入式印刷电路板可以包括：第一基板，其具有形成在其中的空腔;第一电子部件，以面朝下的方式嵌入在所述空腔中;第二电子部件 所述第一基板被堆叠在所述第一电子部件的上侧并以面朝上的方式嵌入所述空腔中;以及第二基板，其被堆叠在所述第一基板的上表面和下表面上。