Invention Grant
- Patent Title: Thermally expanded microspheres and a process for producing the same
- Patent Title (中): 热膨胀微球及其制备方法
-
Application No.: US13355647Application Date: 2012-01-23
-
Publication No.: US08486531B2Publication Date: 2013-07-16
- Inventor: Toshiaki Masuda , Ichiro Takahara , Kenichi Kitano , Katsushi Miki , Takeshi Inohara , Takayuki Aoki
- Applicant: Toshiaki Masuda , Ichiro Takahara , Kenichi Kitano , Katsushi Miki , Takeshi Inohara , Takayuki Aoki
- Applicant Address: JP Yao-Shi
- Assignee: Matsumoto Yushi-Seiyaku Co., Ltd.
- Current Assignee: Matsumoto Yushi-Seiyaku Co., Ltd.
- Current Assignee Address: JP Yao-Shi
- Agency: Global IP Counselors, LLP
- Priority: JP2005-303626 20050916
- Main IPC: B32B1/00
- IPC: B32B1/00 ; B32B5/16 ; C08J9/22 ; C08J9/00
Abstract:
The present invention provides heat-expanded microspheres having high packing efficiency, and a production method thereof. The heat-expanded microspheres are produced by expanding heat-expandable microspheres, which comprise shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 micrometer, at a temperature not lower than their expansion initiating temperature, and the heat-expanded microspheres result in a void fraction not higher than 0.70.
Public/Granted literature
- US20120121907A1 THERMALLY EXPANDED MICROSPHERES AND A PROCESS FOR PRODUCING THE SAME Public/Granted day:2012-05-17
Information query
