发明授权
- 专利标题： Method for the producing of a light-emitting semiconductor chip, method for the production of a conversion die and light-emitting semiconductor chip
- 专利标题（中）： 用于制造发光半导体芯片的方法，用于制造转换晶片和发光半导体芯片的方法
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申请号： US13098240申请日： 2011-04-29
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公开(公告)号： US08492182B2公开(公告)日： 2013-07-23
- 发明人: Norwin Von Malm , Madis Raukas , Darshan Kundaliya
- 申请人： Norwin Von Malm , Madis Raukas , Darshan Kundaliya
- 申请人地址： DE Regensburg US MA Danvers
- 专利权人： OSRAM Opto Semiconductors GmbH,OSRAM SYLVANIA Inc.
- 当前专利权人： OSRAM Opto Semiconductors GmbH,OSRAM SYLVANIA Inc.
- 当前专利权人地址： DE Regensburg US MA Danvers
- 代理机构： Cozen O'Connor
- 主分类号： H01L33/50
- IPC分类号： H01L33/50 ; C23C14/40
摘要：
A light-emitting semiconductor chip is provided, the semiconductor chip comprising a semiconductor body having a pixel region with at least two electrically isolated sub-regions, each sub-region comprising an active layer, which generates electromagnetic radiation of a first wavelength range during operation, a separately manufactured ceramic conversion die over a radiation emission area of at least one sub-region, said conversion die being configured to convert radiation of the first wavelength range into electromagnetic radiation of a second wavelength range, wherein a width of the conversion die does not exceed 100 μm. Further, a method for the production of a light-emitting semiconductor chip and method for the production of a conversion die are provided.
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