Invention Grant
- Patent Title: Systems and methods for in situ annealing of electro- and electroless platings during deposition
- Patent Title (中): 沉积期间电化学镀和无电镀的原位退火的系统和方法
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Application No.: US12208287Application Date: 2008-09-10
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Publication No.: US08496799B2Publication Date: 2013-07-30
- Inventor: Robert J. Von Gutfeld , Alan C. West
- Applicant: Robert J. Von Gutfeld , Alan C. West
- Applicant Address: US NY New York
- Assignee: The Trustees of Columbia University in the City of New York
- Current Assignee: The Trustees of Columbia University in the City of New York
- Current Assignee Address: US NY New York
- Agency: Baker Botts, L.L.P.
- Main IPC: C25D5/08
- IPC: C25D5/08 ; C23C18/16 ; B05D1/02
Abstract:
Systems and methods for in-situ annealing of metal layers as they are being plated on a substrate by action of a chemical solution are provided. The in-situ annealing, in conjunction with controlled slow growth rates, allows control of the structure of the plated metal layers. The systems and methods are used for maskless plating of the substrates.
Public/Granted literature
- US20090081386A1 SYSTEMS AND METHODS FOR IN SITU ANNEALING OF ELECTRO- AND ELECTROLESS PLATINGS DURING DEPOSITION Public/Granted day:2009-03-26
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