发明授权
- 专利标题： Positive photosensitive resin composition
- 专利标题（中）： 正型感光性树脂组合物
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申请号： US13241612申请日： 2011-09-23
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公开(公告)号： US08501375B2公开(公告)日： 2013-08-06
- 发明人: Hyun-Yong Cho , Min-Kook Chung , Ji-Young Jeong , Jong-Hwa Lee , Yong-Sik Yoo , Jeong-Woo Lee , Hwan-Sung Cheon , Soo-Young Kim , Young-Ho Kim , Jae-Hyun Kim , Su-Min Park
- 申请人： Hyun-Yong Cho , Min-Kook Chung , Ji-Young Jeong , Jong-Hwa Lee , Yong-Sik Yoo , Jeong-Woo Lee , Hwan-Sung Cheon , Soo-Young Kim , Young-Ho Kim , Jae-Hyun Kim , Su-Min Park
- 申请人地址： KR Gum-si
- 专利权人： Cheil Industries Inc.
- 当前专利权人： Cheil Industries Inc.
- 当前专利权人地址： KR Gum-si
- 代理机构： Summa, Additon & Ashe, P.A.
- 优先权： KR10-2010-0130786 20101220
- 主分类号： G03F7/023
- IPC分类号： G03F7/023
摘要：
Disclosed is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. In the above Chemical Formula 1, each substituent is the same as defined in the specification.
公开/授权文献
- US20120156616A1 Positive Photosensitive Resin Composition 公开/授权日：2012-06-21
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