摘要:
A hard mask composition, a method of forming a pattern, and a semiconductor integrated circuit device, the hard mask composition including a solvent; and a compound, the compound including a structural unit represented by the following Chemical Formula 1:
摘要:
Disclosed is an image sensor including a photo-sensing device, a color filter positioned on the photo-sensing device, a microlens positioned on the color filter, and an insulation layer positioned between the photo-sensing device and the color filter, and including a trench exposing the photo-sensing device and a filler filled in the trench. The filler has light transmittance of about 85% or more at a visible ray region, and a higher refractive index than the insulation layer. A method of manufacturing the image sensor is also provided.
摘要:
Disclosed are photosensitive resin composition that includes a dye including a methine-based compound represented by the following Chemical Formula 1, wherein each substituent of Chemical Formula 1 is the same as defined in the detailed description, and a metal complex, and a color filter using the same.
摘要:
Disclosed is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. In the above Chemical Formula 1, each substituent is the same as defined in the specification.
摘要:
An aromatic ring-containing polymer for a resist underlayer, the polymer including a unit represented by the following Chemical Formula 1: wherein, R1 and R2 are independently hydrogen, a C1 to C10 alkyl group, or an aromatic group, A is a functional group derived from an aromatic compound with a heteroatom or without a heteroatom, and n is an integer of one or more.
摘要:
A resist underlayer composition, a method of forming patterns, and semiconductor integrated circuit device, the composition including a solvent; and a compound including a moiety represented by the following Chemical Formula 1:
摘要:
Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a dissolution controlling agent including the compound represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, and a photosensitive resin film prepared by using the same.
摘要:
An epoxy resin composition includes: an epoxy resin; a curing agent; a curing accelerator; and an inorganic filler, wherein the curing accelerator includes a 4-valent ammonium salt or a 4-valent phosphonium salt represented by Formula 1, wherein A1 is nitrogen or phosphorus; R1, R2, R3 and R4 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom; X1, X2, X3, X4, X5 and X6 are each independently an oxygen atom (O), a sulfur atom (S), or NH; and Y1, Y2 and Y3 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom.
摘要翻译:环氧树脂组合物包括:环氧树脂; 固化剂; 固化促进剂; 和无机填料,其中固化促进剂包括由式1表示的4价铵盐或4价鏻盐,其中A1为氮或磷; R 1,R 2,R 3和R 4各自独立地为取代或未取代的C 1〜C 30烃基,或者取代或未取代的包含杂原子的C 1〜C 30烃基; X1,X2,X3,X4,X5和X6各自独立地为氧原子(O),硫原子(S)或NH; Y 1,Y 2和Y 3各自独立地为取代或未取代的C1〜C30烃基,或者含有杂原子的取代或未取代的C1〜C30烃基。