EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
    10.
    发明申请
    EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME 有权
    用于封装半导体器件的环氧树脂组合物和使用其形成的半导体器件

    公开(公告)号:US20140179835A1

    公开(公告)日:2014-06-26

    申请号:US14140607

    申请日:2013-12-26

    IPC分类号: C08K3/36

    摘要: An epoxy resin composition includes: an epoxy resin; a curing agent; a curing accelerator; and an inorganic filler, wherein the curing accelerator includes a 4-valent ammonium salt or a 4-valent phosphonium salt represented by Formula 1, wherein A1 is nitrogen or phosphorus; R1, R2, R3 and R4 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom; X1, X2, X3, X4, X5 and X6 are each independently an oxygen atom (O), a sulfur atom (S), or NH; and Y1, Y2 and Y3 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom.

    摘要翻译: 环氧树脂组合物包括:环氧树脂; 固化剂; 固化促进剂; 和无机填料,其中固化促进剂包括由式1表示的4价铵盐或4价鏻盐,其中A1为氮或磷; R 1,R 2,R 3和R 4各自独立地为取代或未取代的C 1〜C 30烃基,或者取代或未取代的包含杂原子的C 1〜C 30烃基; X1,X2,X3,X4,X5和X6各自独立地为氧原子(O),硫原子(S)或NH; Y 1,Y 2和Y 3各自独立地为取代或未取代的C1〜C30烃基,或者含有杂原子的取代或未取代的C1〜C30烃基。