Invention Grant
- Patent Title: Die and die device
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Application No.: US12329742Application Date: 2008-12-08
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Publication No.: US08506282B2Publication Date: 2013-08-13
- Inventor: Kinshiro Naito , Masayuki Shimizu , Shigeru Endo , Takashi Matsumoto , Hiroshi Nakai , Hiroyuki Kobayashi
- Applicant: Kinshiro Naito , Masayuki Shimizu , Shigeru Endo , Takashi Matsumoto , Hiroshi Nakai , Hiroyuki Kobayashi
- Applicant Address: JP Kanagawa
- Assignee: Amada Company, Limited
- Current Assignee: Amada Company, Limited
- Current Assignee Address: JP Kanagawa
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2002-177211 20020618; JP2003-142267 20030520
- Main IPC: B26D7/08
- IPC: B26D7/08 ; B28B13/00

Abstract:
A die body includes a die hole for punching a work. A core, including a discharge hole, which is in communication with the die hole, is provided in the die body. The core is provided with a plurality of fluid injection ports through which fluid is injected downward of the discharge hole. The die body is provided with inflow ports through which compressed fluid flows into the fluid injection ports. The core is made of resin. The discharge hole is tapered toward its upper side. An outer peripheral surface of the die body is provided with a peripheral groove which is in communication with the inflow ports.
Public/Granted literature
- US20090120261A1 DIE AND DIE DEVICE Public/Granted day:2009-05-14
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