Invention Grant
US08506904B2 Sample arraying/assembling device, its method, and apparatus using sample assembly
失效
样品排列/组装装置,其方法和使用样品组件的装置
- Patent Title: Sample arraying/assembling device, its method, and apparatus using sample assembly
- Patent Title (中): 样品排列/组装装置,其方法和使用样品组件的装置
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Application No.: US13252879Application Date: 2011-10-04
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Publication No.: US08506904B2Publication Date: 2013-08-13
- Inventor: Hideji Tajima , Yukiko Miyashita , Osamu Segawa
- Applicant: Hideji Tajima , Yukiko Miyashita , Osamu Segawa
- Applicant Address: JP Matsudo-Shi, Chiba
- Assignee: Universal Bio Research Co., Ltd.
- Current Assignee: Universal Bio Research Co., Ltd.
- Current Assignee Address: JP Matsudo-Shi, Chiba
- Agency: Haynes and Boone, LLP
- Priority: JP2003-177228 20030620
- Main IPC: B01L3/00
- IPC: B01L3/00 ; B01L99/00 ; C12M1/34 ; C12M3/00

Abstract:
The present invention relates to a sample arraying/assembling device, its method, and an apparatus using a sample assembly, and has an object of providing a sample arraying/assembling device which is adapted to various microplates, and is capable of efficiently and quickly arraying and assembling various samples; its method; and an apparatus using a sample assembly.The present invention includes: a distributing section which is capable of holding respective solutions containing samples to be distributed, and which has a plurality of holding ends arranged in a predetermined matrix; and a wound body which has a plane surface wound with a slender foundation member on which samples are to be distributed at distribution intervals of column or line of the matrix, which is arranged in parallel at the winding intervals of the line or column on the plane surface, so that the respective holding ends can come into contact therewith.
Public/Granted literature
- US20120053090A1 SAMPLE ARRAYING/ASSEMBLING DEVICE, ITS METHOD, AND APPARATUS USING SAMPLE ASSEMBLY Public/Granted day:2012-03-01
Information query
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