发明授权
- 专利标题： Dual wafer spin coating
- 专利标题（中）： 双晶圆片旋涂
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申请号： US12974611申请日： 2010-12-21
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公开(公告)号： US08512491B2公开(公告)日： 2013-08-20
- 发明人: Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Piyush Savalia , Craig Mitchell
- 申请人： Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Piyush Savalia , Craig Mitchell
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号： B32B41/00
- IPC分类号： B32B41/00
摘要：
A method of bonding a first substrate and a second substrate includes the steps of rotating first substrate with an adhesive mass thereon, and second substrate contacting the mass and overlying the first substrate, controlling a vertical height of a heated control platen spaced apart from and not contacting the second substrate so as to control a temperature of the adhesive mass, so as to at least one of bond the first and second substrates in alignment with one another, or achieve a sufficiently planar adhesive interface between the first and second substrates.
公开/授权文献
- US20120152433A1 DUAL WAFER SPIN COATING 公开/授权日：2012-06-21