发明授权
- 专利标题： Semiconductor package with integrated inductor
- 专利标题（中）： 集成电感的半导体封装
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申请号： US12795230申请日： 2010-06-07
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公开(公告)号： US08513771B2公开(公告)日： 2013-08-20
- 发明人: Klaus Elian , Horst Theuss , Georg Meyer-Berg
- 申请人： Klaus Elian , Horst Theuss , Georg Meyer-Berg
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L29/86
- IPC分类号： H01L29/86 ; H01L21/56
摘要：
A semiconductor package includes a semiconductor chip. An inductor is applied to the semiconductor chip. The inductor has at least one winding. An encapsulation body is formed of an encapsulation material. The encapsulation material contains a magnetic component and fills a space within the winding to form a magnetic winding core.
公开/授权文献
- US20110298088A1 Semiconductor Package with Integrated Inductor 公开/授权日：2011-12-08
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