Invention Grant
- Patent Title: System and method for multi-application socket
- Patent Title (中): 多应用套接字的系统和方法
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Application No.: US12945111Application Date: 2010-11-12
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Publication No.: US08514583B2Publication Date: 2013-08-20
- Inventor: Roger D. Weekly
- Applicant: Roger D. Weekly
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hamilton & Terrile, LLP
- Agent Robert W. Holland
- Main IPC: H05K7/02
- IPC: H05K7/02

Abstract:
A processor module socket accommodates processor modules of different sizes with adapters that align smaller-sized modules so that module pins align with desired contact points. The largest supported processor module engages with the socket in a conventional manner without the use of an adapter. Smaller processor modules engage within an adapter that in turn engages in the socket in a manner similar to the largest supported processor module. The contact points of the socket support different sized processor modules by keying logical functions based upon the type of processor module installed in the socket.
Public/Granted literature
- US20120120576A1 SYSTEM AND METHOD FOR MULTI-APPLICATION SOCKET Public/Granted day:2012-05-17
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