发明授权
- 专利标题: Processing apparatus and method
- 专利标题(中): 处理装置和方法
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申请号: US11625592申请日: 2007-01-22
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公开(公告)号: US08517035B2公开(公告)日: 2013-08-27
- 发明人: Takahiko Wakatsuki , Naoya Hayamizu , Hiroshi Fujita , Akiko Saito , Toshihide Hayashi , Yukinobu Nishibe
- 申请人: Takahiko Wakatsuki , Naoya Hayamizu , Hiroshi Fujita , Akiko Saito , Toshihide Hayashi , Yukinobu Nishibe
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2006-013652 20060123
- 主分类号: B08B3/00
- IPC分类号: B08B3/00
摘要:
A processing apparatus includes: a processing chamber configured to contain a workpiece; a first nozzle provided in the processing chamber, the first nozzle discharging vapor onto the workpiece; a wall enclosing the processing chamber; a fluid channel provided inside the wall; a fluid inlet; and a fluid outlet.The fluid inlet is provided in communication with the fluid channel. The fluid outlet is provided in communication with the fluid channel, where a fluid flows into the fluid inlet, passes through the fluid channel, and flows out of the fluid outlet. A processing method for processing a workpiece moving in a processing chamber, the processing method includes: discharging a vapor from a first nozzle toward the workpiece while flowing a fluid through a fluid channel which is provided inside a wall, the wall enclosing the processing chamber.
公开/授权文献
- US20070246097A1 PROCESSING APPARATUS AND METHOD 公开/授权日:2007-10-25
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