发明授权
- 专利标题： Method for producing a sensor board
- 专利标题（中）： 传感器板的制造方法
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申请号： US12461492申请日： 2009-08-13
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公开(公告)号： US08522428B2公开(公告)日： 2013-09-03
- 发明人: Hiroyuki Hanazono , Hiroshi Yamazaki
- 申请人： Hiroyuki Hanazono , Hiroshi Yamazaki
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Edwards Neils PLLC
- 代理商 Jean C. Edwards, Esq.
- 优先权： JP2008-241425 20080919
- 主分类号： H05K3/02
- IPC分类号： H05K3/02 ; H05K3/10
摘要：
A method for producing a sensor board includes the steps of preparing an insulating layer; forming at least a pair of electrodes on the insulating layer; and forming a conductive layer by spraying a conductive component-containing liquid onto the insulating layer by an ultrasonic spray method so as to cover the electrodes.
公开/授权文献
- US20100073886A1 Sensor board and producing method thereof 公开/授权日：2010-03-25
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