发明授权
- 专利标题: Device and method for supporting a substrate
- 专利标题(中): 用于支撑衬底的装置和方法
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申请号: US12748652申请日: 2010-03-29
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公开(公告)号: US08528889B2公开(公告)日: 2013-09-10
- 发明人: Seiji Nakano , Michiaki Matsushita , Naruaki Iida , Suguru Enokida , Katsuhiro Morikawa
- 申请人: Seiji Nakano , Michiaki Matsushita , Naruaki Iida , Suguru Enokida , Katsuhiro Morikawa
- 申请人地址: JP Minato-Ku
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Minato-Ku
- 代理机构: Burr & Brown
- 优先权: JP2009-087150 20090331; JP2009-088309 20090331; JP2009-088310 20090331
- 主分类号: B23Q3/00
- IPC分类号: B23Q3/00 ; B25B1/00
摘要:
A substrate support device including a support member having a lower-surface support section to support a lower surface of a substrate; and a position restriction section provided on the lower-surface support section, the position restriction section being formed to surround a periphery of the substrate supported on the lower-surface support section and restrict a position of the substrate. At least one of the lower-surface support section and the position restriction section includes a base material and a protective film formed to cover the base material and prevent at least one of wear and chemical erosion to which the base material will be subject. The substrate support device further includes, for example, a base that supports the support member, and a driving structure that moves the support member in a relative fashion with respect to the base, and is constructed as a substrate transport device.
公开/授权文献
- US20100243168A1 DEVICE AND METHOD FOR SUPPORTING A SUBSTRATE 公开/授权日:2010-09-30
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