摘要:
A coating and developing apparatus has an interface section equipped with a temperature adjuster (a cooling unit). A temperature-raised substrate due to exposure on periphery of the substrate outside a circuit-forming area thereon is adjusted to a predetermined temperature by the temperature adjuster and then transferred to an exposing apparatus. The temperature adjustments before exposure provide almost the same temperature over many substrates to be transferred to the exposing apparatus for less thermal effects to exposing processing, thus achieving high yields. The interface section is further provided with first and second transfer mechanisms, the first serving to transfer substrates between the processor and the exposing apparatus and the second serving to transfer substrates to each unit of a shelf section, for high transfer performance, thus achieving high throughput.
摘要:
There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.
摘要:
A substrate dual-side processing apparatus has a processor to apply a specific process to a front surface and a rear surface of a substrate, a reversing unit to reverse the substrate and a substrate-transfer mechanism to transfer the substrate between the processor and the reversing unit. The reversing unit has a holder for holding the substrate when the substrate is being transferred to and from the substrate-transfer mechanism and a rotating mechanism for rotating the substrate, thus the substrate being reversed while held by the holders. The reversing unit may have a pair of holders for holding the substrate at the front and rear surfaces, a drive mechanism for driving the pair of holders so that the holders become close to or apart from each other and a rotating mechanism for rotating the substrate, thus the substrate being reversed while held by the holders.
摘要:
A cassette waiting block is connected to a transfer in/out block of a coating and developing treatment system, and in the cassette waiting block, a cassette transfer in/out unit, a cassette waiting unit, a cassette delivery unit, and a substrate processing unit are provided. In the cassette waiting block, a cassette transfer unit for transferring the cassette between the cassette transfer in/out unit, the cassette waiting unit, and the cassette deliver unit, and a transfer unit for transferring the substrate between the cassette in the cassette waiting unit and the substrate processing unit are provided. Each cassette waiting unit has an opening mechanism for opening a port of the cassette.
摘要:
There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.
摘要:
A substrates-cleaning apparatus including a first unit provided with a scrubber for scrubbing a single side of a substrate, a second unit provided with a turning mechanism for turning the substrate upside down or vice versa, and a carrier robot for carrying the substrate between the first and the second unit.
摘要:
A substrate cleaning device comprising a motor for rotating a wafer together with a spin plate, claws for holding the wafer so as to form a space between the spin plate and the wafer, a jet nozzle through which cleaning solution is jetted onto an upper surface of the wafer, a rotating brush for brush-cleaning the upper surface of the wafer, a mechanism for blowing nitrogen gas or pure water onto the lower surface of the wafer, and a mechanism for exhausting the space between the spin plate and the wafer, wherein a solution passage for the solution blowing mechanism and an exhaust passage for the exhaust mechanism are formed in a drive shaft of the motor and communicated with the space.
摘要:
A cassette waiting block is connected to a transfer in/out block of a coating and developing treatment system, and in the cassette waiting block, a cassette transfer in/out unit, a cassette waiting unit, a cassette delivery unit, and a substrate processing unit are provided. In the cassette waiting block, a cassette transfer unit for transferring the cassette between the cassette transfer in/out unit, the cassette waiting unit, and the cassette deliver unit, and a transfer unit for transferring the substrate between the cassette in the cassette waiting unit and the substrate processing unit are provided. Each cassette waiting unit has an opening mechanism for opening a port of the cassette.
摘要:
A cleaning apparatus for cleaning a semiconductor wafer comprises a spin chuck having a turn table. A gas supplying passage is formed in a shaft for supporting the turn table to supply a protecting gas to the rear surface of the wafer. A conical movable member, arranged to cover an end off the shaft, is movable upward and downward in accordance with the flow off the protecting gas supplied thereto. Inner ends of three reciprocating arms, supported by the turn table and extending in radial directions, abut against an outer surface of the movable member and biased by springs. Fixed pins are arranged on the turn table at positions which divide the circumference of the turn table into three equal parts, along the edge of the wafer. Three swingable levers are arranged such that one is provided between two adjacent fixed pins. One end of each swingable lever is connected to the outer end of each reciprocating arm and the other end of the lever has a pin brought into contact with the edge of the wafer. When the protecting gas is supplied, the movable member is moved upward to a working position, and the reciprocating arms are pressed by the movable member and moved outward. As a result, the swingable levers are moved so as to bring their pins into contact with the edge of the wafer, thereby clamping the wafer among the pins.
摘要:
A substrate support device including a support member having a lower-surface support section to support a lower surface of a substrate; and a position restriction section provided on the lower-surface support section, the position restriction section being formed to surround a periphery of the substrate supported on the lower-surface support section and restrict a position of the substrate. At least one of the lower-surface support section and the position restriction section includes a base material and a protective film formed to cover the base material and prevent at least one of wear and chemical erosion to which the base material will be subject. The substrate support device further includes, for example, a base that supports the support member, and a driving structure that moves the support member in a relative fashion with respect to the base, and is constructed as a substrate transport device.