发明授权
- 专利标题: Light emitting device package and lighting system including the same
- 专利标题(中): 发光装置封装和照明系统包括相同
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申请号: US13037868申请日: 2011-03-01
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公开(公告)号: US08530925B2公开(公告)日: 2013-09-10
- 发明人: Hye Young Kim
- 申请人: Hye Young Kim
- 申请人地址: KR Seoul
- 专利权人: LG Innotek Co., Ltd.
- 当前专利权人: LG Innotek Co., Ltd.
- 当前专利权人地址: KR Seoul
- 代理机构: McKenna Long & Aldridge LLP
- 优先权: KR10-2010-0020647 20100309
- 主分类号: H01L29/22
- IPC分类号: H01L29/22 ; H01L33/00 ; H01L31/0203 ; H01L29/227
摘要:
Provided are a light emitting device package and a lighting system including the same. The light emitting device package includes: a body, a plurality of electrode layers, a light emitting device, and a molding member. The body includes a plurality of pits. The electrode layers include first protrusions disposed in the pits, and second protrusions protruding in a direction opposite to the first protrusions. The light emitting device is disposed on at least one of the plurality of electrode layers. The molding member is disposed on the light emitting device.
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