Invention Grant
- Patent Title: Solder paste transfer process
- Patent Title (中): 焊膏转印工艺
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Application No.: US13354080Application Date: 2012-01-19
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Publication No.: US08534533B2Publication Date: 2013-09-17
- Inventor: William D. Beair , Michael R. Williams , Eric Gilley
- Applicant: William D. Beair , Michael R. Williams , Eric Gilley
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Cantor Colburn LLP
- Main IPC: B23K31/00
- IPC: B23K31/00 ; B23K31/02
Abstract:
A solder paste transfer process is provided and includes defining an arrangement of solder pad locations on a surface, applying solder paste onto a transfer tool in a pre-defined configuration reflective of the arrangement, disposing the transfer tool in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the transfer tool to the solder pad locations.
Public/Granted literature
- US20130186946A1 SOLDER PASTE TRANSFER PROCESS Public/Granted day:2013-07-25
Information query
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