发明授权
- 专利标题： Solder paste transfer process
- 专利标题（中）： 焊膏转印工艺
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申请号： US13354080申请日： 2012-01-19
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公开(公告)号： US08534533B2公开(公告)日： 2013-09-17
- 发明人: William D. Beair , Michael R. Williams , Eric Gilley
- 申请人： William D. Beair , Michael R. Williams , Eric Gilley
- 申请人地址： US MA Waltham
- 专利权人： Raytheon Company
- 当前专利权人： Raytheon Company
- 当前专利权人地址： US MA Waltham
- 代理机构： Cantor Colburn LLP
- 主分类号： B23K31/00
- IPC分类号： B23K31/00 ; B23K31/02
摘要：
A solder paste transfer process is provided and includes defining an arrangement of solder pad locations on a surface, applying solder paste onto a transfer tool in a pre-defined configuration reflective of the arrangement, disposing the transfer tool in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the transfer tool to the solder pad locations.
公开/授权文献
- US20130186946A1 SOLDER PASTE TRANSFER PROCESS 公开/授权日：2013-07-25
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