发明授权
US08541690B2 Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component
有权
用于将电子部件固定在印刷电路板上的方法和包括印刷电路板和至少一个电子部件的系统
- 专利标题： Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component
- 专利标题（中）： 用于将电子部件固定在印刷电路板上的方法和包括印刷电路板和至少一个电子部件的系统
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申请号： US12227364申请日： 2007-05-15
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公开(公告)号： US08541690B2公开(公告)日： 2013-09-24
- 发明人: Hannes Voraberger , Gerhard Schmid , Markus Riester , Johannes Stahr
- 申请人： Hannes Voraberger , Gerhard Schmid , Markus Riester , Johannes Stahr
- 申请人地址： AT Leoben-Hinterberg
- 专利权人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- 当前专利权人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- 当前专利权人地址： AT Leoben-Hinterberg
- 代理机构： Jacobson Holman PLLC
- 优先权： ATGM393/2006 20060516
- 国际申请： PCT/AT2007/000234 WO 20070515
- 国际公布： WO2007/131256 WO 20071122
- 主分类号： H05K1/16
- IPC分类号： H05K1/16 ; H05K1/18
摘要：
A method for fixing an electronic component on a printed circuit board, and contact-connecting the electronic component to the printed circuit board, the following steps are provided:—providing the printed circuit board having a plurality of contact and connection pads,—providing the electronic component having a number of contact and connection locations corresponding to the plurality of contact and connection pads, with a mutual spacing reduced in comparison with the spacing of the contact and connection pads, and—arranging or forming at least one interlayer for routing the contact and connection locations of the electronic component between the contact and connection pads and the contact and connection locations of the electronic component. A method for producing an interlayer for routing and a system having a printed circuit board and an electronic component using the interlayer for routing are also provided.