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公开(公告)号：US12112888B2
公开(公告)日：2024-10-08
申请号：US17650388
申请日：2022-02-09
CPC分类号： H01F7/0242 , H01F41/0253
摘要： A drive device includes a component carrier with a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a cavity formed in the stack. A driven body is arranged at least partially in the cavity and configured for being drivable to move relative to the component carrier. At least one drive coil for creating a magnetic drive field and at least one drive magnet interacts with the magnetic drive field created by the at least one drive coil to generate a force for moving the driven body relative to the component carrier. One of the at least one drive magnet and the at least one drive coil forms part of the component carrier and the other one of the at least one drive magnet and the at least one drive coil forms part of the driven body.
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公开(公告)号：US20240114656A1
公开(公告)日：2024-04-04
申请号：US18537287
申请日：2023-12-12
发明人： Gerald Weis
IPC分类号： H05K7/20
CPC分类号： H05K7/20272 , H05K7/20263 , H05K7/20927 , H05K7/20145
摘要： An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure. The connection structure comprises thermal interface material which contributes to a heat removal from the electronic component to the cooling unit.
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公开(公告)号：US11778754B2
公开(公告)日：2023-10-03
申请号：US16777116
申请日：2020-01-30
发明人： Robin Zhang , Seok Kim Tay
CPC分类号： H05K3/429 , H05K1/115 , H05K1/186 , H05K3/423 , H05K2201/0959 , H05K2201/09827 , H05K2203/1572
摘要： A component carrier includes an electrically insulating layer structure with a first main surface and a second main surface, a through hole extends through the electrically insulating layer structure between the first main surface and the second main surface. The through hole has a first tapering portion extending from the first main surface and a second tapering portion extending from the second main surface. The through hole is delimited by a first plating structure on at least part of the sidewalls of the electrically insulating layer structure and a second plating structure formed separately from and arranged on the first plating structure. The second plating structure includes an electrically conductive bridge structure connecting the opposing sidewalls.
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公开(公告)号：US11778751B2
公开(公告)日：2023-10-03
申请号：US17247151
申请日：2020-12-01
发明人： Abderrazzaq Ifis , Markus Leitgeb
CPC分类号： H05K3/303 , G06T7/0006 , H05K3/4638 , G06T2207/30141 , H05K2203/166
摘要： A method of compensating misalignment during manufacturing laminate-type component carriers is disclosed. The method includes detecting an image of a region of interest of a component carrier structure during manufacturing the component carriers based on the component carrier structure, identifying a structural feature in the image of the region of interest showing misalignment with respect to a target design, and at least partially compensating the identified misalignment of the structural feature by modifying the target design of at least one correlated structural feature to be manufactured subsequently, wherein the at least one correlated structural feature is correlated to said structural feature showing misalignment.
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公开(公告)号：US11749613B2
公开(公告)日：2023-09-05
申请号：US17451012
申请日：2021-10-15
发明人： Gerald Weidinger , Andreas Zluc
IPC分类号： H01L23/538 , H01L23/31 , H01L23/373 , H01L23/00 , H01L21/48 , H01L21/56
CPC分类号： H01L23/5389 , H01L21/4853 , H01L21/565 , H01L21/568 , H01L23/3121 , H01L23/373 , H01L23/5386 , H01L24/19 , H01L24/20 , H01L2224/214
摘要： A method for manufacturing a component carrier includes forming a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, providing a component having one or more pads and at least one dielectric layer on at least one main surface of the component such that the dielectric layer at least partially covers one or more pads of the component, placing the component on a temporary carrier, and embedding the component between the temporary carrier and the at least one insulating layer structure by pressing the component into the at least one insulating layer structure.
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公开(公告)号：US11622443B2
公开(公告)日：2023-04-04
申请号：US17301756
申请日：2021-04-13
发明人： Artan Baftiri
摘要： A component carrier includes a stack having a first electrically insulating layer structure and a first electrically conductive layer structure arranged on the first electrically insulating layer structure. The first electrically insulating layer structure has at least one first covered portion, which is covered by the first electrically conductive layer structure, and at least one first non-covered portion, which is not covered by the first electrically conductive layer structure. The first electrically insulating layer structure defines a recess at the at least one first non-covered portion.
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公开(公告)号：US11612064B2
公开(公告)日：2023-03-21
申请号：US17302599
申请日：2021-05-07
IPC分类号： H05K1/03 , H05K3/00 , H01L21/67 , H01L21/70 , H01L21/768 , H01L23/12 , H01L23/498 , H05K3/34 , H05K3/42
摘要： A component carrier includes (a) a first stack with at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure; (b) a hole formed within the first stack; and (c) a non-deformable solid body closing a portion of the hole and being spaced with respect to side walls of the hole by a gap. A component carrier assembly includes (a) a component carrier as described above; (b) a second stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure; and (c) a connection piece connecting the first stack with the second stack. Further described are methods for manufacturing such a component carrier and such a component carrier assembly.
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公开(公告)号：US20230054846A1
公开(公告)日：2023-02-23
申请号：US18045376
申请日：2022-10-10
发明人： Thomas KRIVEC
摘要： A component carrier for carrying at least one electronic component includes (a) a plurality of electrically conductive layers; (b) a plurality of electrically insulating layers; and (c) a thermoplastic structure. The electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate. Further, a method for manufacturing such a component carrier and an electronic apparatus including such a component carrier are provided.
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公开(公告)号：US11523520B2
公开(公告)日：2022-12-06
申请号：US16184470
申请日：2018-11-08
发明人： Gerald Weidinger , Andreas Zluc , Johannes Stahr
摘要： The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps: Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer, Embedding of at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer, Application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component, Clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist, by application of a semi-additive process, deposition of a layer of conductor material onto the cleared end faces of the contacts and the cleared areas of the conductor layer and formation of a conductor pattern on at least the one outer surface of the core on which the component is arranged, as well as the interconnecting paths between the contacts and the conductor pattern, and Removal of the areas of the conductor layer not belonging to the conductor pattern.
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公开(公告)号：US20220377896A1
公开(公告)日：2022-11-24
申请号：US17663418
申请日：2022-05-13
发明人： Ivan SALKOVIC , Vanesa LÓPEZ BLANCO
摘要： A component carrier includes a stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a magnetic element assembled to the stack, and a dielectric layer structure on the stack. The magnetic element includes an embedded inductive element. The dielectric layer structure at least partially surrounds the magnetic element. Further, a manufacturing method and a use of photo-imaging are described.
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