发明授权
- 专利标题: Apparatus for aligning electronic components
- 专利标题(中): 用于对准电子部件的装置
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申请号: US12748997申请日: 2010-03-29
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公开(公告)号: US08544165B2公开(公告)日: 2013-10-01
- 发明人: Chi Kuen Vincent Leung , Bin Xie , Xunqing Shi
- 申请人: Chi Kuen Vincent Leung , Bin Xie , Xunqing Shi
- 申请人地址: HK Shatin, New Territories
- 专利权人: Hong Kong Applied Science & Technology Research Institute Co., Ltd.
- 当前专利权人: Hong Kong Applied Science & Technology Research Institute Co., Ltd.
- 当前专利权人地址: HK Shatin, New Territories
- 主分类号: B23P19/00
- IPC分类号: B23P19/00
摘要:
A method of aligning electronic components comprising providing a positioning member 110 having at least one formation 120 for receiving an electronic component; said at least one formation having lateral boundaries 35, 36 for constraining movement of an electronic component; placing a first electronic component 10a in said at least one formation; and providing a force for actively aligning said first electronic component with a lateral boundary of said at least one formation. The force may, for example, be provided by tilting the positioning member, by providing suction or by using an actuator. An apparatus for aligning electronic components and a 3D system of stacked electronic components is also disclosed.
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