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    Electronic package with stacked modules with channels passing through metal layers of the modules
    1.
    发明授权
    Electronic package with stacked modules with channels passing through metal layers of the modules 有权
    具有堆叠模块的电子封装，通道通过模块的金属层

    公开(公告)号：US08194411B2

    公开(公告)日：2012-06-05

    申请号：US12415416

    申请日：2009-03-31

    申请人： Chi Kuen Vincent Leung ,  Peng Sun ,  Xunqing Shi ,  Chang Hwa Tom Chung

    发明人： Chi Kuen Vincent Leung ,  Peng Sun ,  Xunqing Shi ,  Chang Hwa Tom Chung

    IPC分类号： H05K1/18

    CPC分类号： H01L24/96 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/00

    摘要： One aspect of the present invention provides an electronic package, comprising at least a first module and a second module arranged on top of the first module, the modules together in the form of a module stack, wherein the first and second modules are adhesively connected together, each module includes a substrate layer having at least one metal layer, at least one die and a plastic(s) package molding compound layer molded over said die or dice, in each module the die or dice are bonded on said substrate layer via the metal layer, a plurality of channels formed generally vertically acting as vias to connect the metal layers and arranged adjacent to the die or dice in at least one of the modules, some or all the channels provided with an inner surface coated with a conductive material layer or filled with a conductive material for electrical connection whereby the dice are electrically connected together, and means serving as an intermediary for providing electrical, mechanical and thermal connectivity, communication externally and connected to the channels.

    摘要翻译： 本发明的一个方面提供了一种电子封装，其包括至少第一模块和布置在第一模块的顶部上的第二模块，模块以模块堆叠的形式在一起，其中第一模块和第二模块被粘合地连接在一起 每个模块包括在每个模块中具有至少一个金属层，至少一个模具和塑料模塑复合层的基底层，模具或模具中的模具或模具经由 金属层，多个通道形成，大体垂直地作为过孔形成，以连接金属层并且在至少一个模块中邻近模具或裸片设置，一些或全部通道设置有涂覆有导电材料层的内表面 或填充导电材料用于电连接，由此骰子电连接在一起，以及作为用于提供电，机械和 rmal连接，外部通信和通道连接。

    Stacked Electronic Components, Method and Apparatus for Aligning Electronic Components
    4.
    发明申请
    Stacked Electronic Components, Method and Apparatus for Aligning Electronic Components 有权
    堆叠电子元件，电子元件对齐方法和装置

    公开(公告)号：US20110235299A1

    公开(公告)日：2011-09-29

    申请号：US12748997

    申请日：2010-03-29

    申请人： Chi Kuen Vincent Leung ,  Bin Xie ,  Xunqing Shi

    发明人： Chi Kuen Vincent Leung ,  Bin Xie ,  Xunqing Shi

    IPC分类号： H05K1/14 ,  H05K3/30 ,  B23P19/00

    CPC分类号： H01L21/67333 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2225/1058 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

    摘要： A method of aligning electronic components comprising providing a positioning member 110 having at least one formation 120 for receiving an electronic component; said at least one formation having lateral boundaries 35, 36 for constraining movement of an electronic component; placing a first electronic component 10a in said at least one formation; and providing a force for actively aligning said first electronic component with a lateral boundary of said at least one formation. The force may, for example, be provided by tilting the positioning member, by providing suction or by using an actuator. An apparatus for aligning electronic components and a 3D system of stacked electronic components is also disclosed.

    摘要翻译： 一种对准电子部件的方法，包括提供具有至少一个结构120的定位部件110，用于接收电子部件; 所述至少一个结构具有用于限制电子部件的运动的横向边界35,36; 将第一电子部件10a放置在所述至少一个结构中; 并且提供用于使所述第一电子部件与所述至少一个结构的横向边界主动对准的力。 例如，可以通过倾斜定位构件，通过提供抽吸或通过使用致动器来提供力。 还公开了一种用于对准电子部件的装置和堆叠的电子部件的3D系统。

    ELECTRONIC PACKAGE AND METHOD OF FABRICATION THEREOF
    5.
    发明申请
    ELECTRONIC PACKAGE AND METHOD OF FABRICATION THEREOF 有权
    电子封装及其制造方法

    公开(公告)号：US20100246141A1

    公开(公告)日：2010-09-30

    申请号：US12415416

    申请日：2009-03-31

    申请人： Chi Kuen Vincent Leung ,  Peng Sun ,  Xunqing Shi ,  Chang Hwa Chung

    发明人： Chi Kuen Vincent Leung ,  Peng Sun ,  Xunqing Shi ,  Chang Hwa Chung

    IPC分类号： H05K7/00 ,  B29C47/00

    CPC分类号： H01L24/96 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/00

    摘要： One aspect of the present invention provides an electronic package, comprising at least a first module and a second module arranged on top of the first module, the modules together in the form of a module stack, wherein the first and second modules are adhesively connected together, each module includes a substrate layer having at least one metal layer, at least one die and a plastic(s) package molding compound layer molded over said die or dice, in each module the die or dice are bonded on said substrate layer via the metal layer, a plurality of channels formed generally vertically acting as vias to connect the metal layers and arranged adjacent to the die or dice in at least one of the modules, some or all the channels provided with an inner surface coated with a conductive material layer or filled with a conductive material for electrical connection whereby the dice are electrically connected together, and means serving as an intermediary for providing electrical, mechanical and thermal connectivity, communication externally and connected to the channels.

    摘要翻译： 本发明的一个方面提供了一种电子封装，其包括至少第一模块和布置在第一模块的顶部上的第二模块，模块以模块堆叠的形式在一起，其中第一模块和第二模块被粘合地连接在一起 每个模块包括在每个模块中具有至少一个金属层，至少一个模具和塑料模塑复合层的基底层，模具或模具中的模具或模具经由 金属层，多个通道形成，大体垂直地作为过孔形成，以连接金属层并且在至少一个模块中邻近模具或裸片设置，一些或全部通道设置有涂覆有导电材料层的内表面 或者用导电材料填充以进行电连接，由此骰子电连接在一起，以及作为用于提供电，机械和 rmal连接，外部通信和通道连接。

    Bonding method for through-silicon-via based 3D wafer stacking
    6.
    发明授权
    Bonding method for through-silicon-via based 3D wafer stacking 有权
    基于硅通孔的3D晶片堆叠的粘合方法

    公开(公告)号：US08030208B2

    公开(公告)日：2011-10-04

    申请号：US12131777

    申请日：2008-06-02

    申请人： Chi Kuen Vincent Leung ,  Peng Sun ,  Xunqing Shi ,  Chang Hwa Chung

    发明人： Chi Kuen Vincent Leung ,  Peng Sun ,  Xunqing Shi ,  Chang Hwa Chung

    IPC分类号： H01L21/4763

    CPC分类号： B23K1/0016 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

    摘要： There is described a bonding method for through-silicon-via bonding of a wafer stack in which the wafers are formed with through-silicon-vias and lateral microchannels that are filled with solder. To fill the vias and channels the wafer stack is placed in a soldering chamber and molten solder is drawn through the vias and channels by vacuum. The wafers are held together by layers of adhesive during the assembly of the wafer stack. Means are provided for local reheating of the solder after it has cooled to soften the solder to enable it to be removed from the soldering chamber.

    摘要翻译： 描述了晶片叠层的硅 - 硅 - 通孔结合的接合方法，其中晶片形成有填充有焊料的通硅通孔和侧向微通道。 为了填充通孔和通道，将晶片堆叠放置在焊接室中，并且熔融的焊料通过真空通过通孔和通道。 在晶片堆叠的组装期间，晶片通过粘合剂层保持在一起。 提供用于在焊料冷却以软化焊料以使其能够从焊接室除去的焊料的局部再加热的装置。

    Apparatus for aligning electronic components
    7.
    发明授权
    Apparatus for aligning electronic components 有权
    用于对准电子部件的装置

    公开(公告)号：US08544165B2

    公开(公告)日：2013-10-01

    申请号：US12748997

    申请日：2010-03-29

    申请人： Chi Kuen Vincent Leung ,  Bin Xie ,  Xunqing Shi

    发明人： Chi Kuen Vincent Leung ,  Bin Xie ,  Xunqing Shi

    IPC分类号： B23P19/00

    CPC分类号： H01L21/67333 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2225/1058 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

    摘要： A method of aligning electronic components comprising providing a positioning member 110 having at least one formation 120 for receiving an electronic component; said at least one formation having lateral boundaries 35, 36 for constraining movement of an electronic component; placing a first electronic component 10a in said at least one formation; and providing a force for actively aligning said first electronic component with a lateral boundary of said at least one formation. The force may, for example, be provided by tilting the positioning member, by providing suction or by using an actuator. An apparatus for aligning electronic components and a 3D system of stacked electronic components is also disclosed.

    摘要翻译： 一种对准电子部件的方法，包括提供具有至少一个结构120的定位部件110，用于接收电子部件; 所述至少一个结构具有用于限制电子部件的运动的横向边界35,36; 将第一电子部件10a放置在所述至少一个结构中; 并且提供用于使所述第一电子部件与所述至少一个结构的横向边界主动对准的力。 例如，可以通过倾斜定位构件，通过提供抽吸或通过使用致动器来提供力。 还公开了一种用于对准电子部件的装置和堆叠的电子部件的3D系统。