Invention Grant
- Patent Title: Semiconductor processing apparatus with simultaneously movable stages
- Patent Title (中): 半导体处理装置具有同步可动级
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Application No.: US12576526Application Date: 2009-10-09
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Publication No.: US08544317B2Publication Date: 2013-10-01
- Inventor: Yu-Fu Lin , Yung-Cheng Chen , Heng-Jen Lee , Chin-Hsiang Lin
- Applicant: Yu-Fu Lin , Yung-Cheng Chen , Heng-Jen Lee , Chin-Hsiang Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: B23Q17/09
- IPC: B23Q17/09 ; G01N19/02

Abstract:
A method and apparatus provide for simultaneously moving multiple semiconductor wafers in opposite directions while simultaneously performing processing operations on each of the wafers. The semiconductor wafers are orientated in coplanar fashion and are disposed on stages that simultaneously translate in opposite directions to produce a net system momentum of zero. The die of the respective semiconductor wafers are processed in the same spatial sequence with respect to a global alignment feature of the semiconductor wafer. A balance mass is not needed to counteract the motion of a stage because the opposite motions of the respective stages cancel each other.
Public/Granted literature
- US20110083496A1 SEMICONDUCTOR PROCESSING APPARATUS WITH SIMULTANEOUSLY MOVABLE STAGES Public/Granted day:2011-04-14
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