Invention Grant
- Patent Title: Forming light-emitting diodes using seed particles
- Patent Title (中): 使用种子颗粒形成发光二极管
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Application No.: US13227905Application Date: 2011-09-08
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Publication No.: US08546165B2Publication Date: 2013-10-01
- Inventor: Jung-Tang Chu , Ching-Hua Chiu , Hung-Wen Huang , Yea-Chen Lee , Hsing-Kuo Hsia
- Applicant: Jung-Tang Chu , Ching-Hua Chiu , Hung-Wen Huang , Yea-Chen Lee , Hsing-Kuo Hsia
- Applicant Address: TW Hsinchu
- Assignee: TSMC Solid State Lighting Ltd.
- Current Assignee: TSMC Solid State Lighting Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/20 ; H01L33/32
Abstract:
A seed layer for growing a group III-V semiconductor structure is embedded in a dielectric material on a carrier substrate. After the group III-V semiconductor structure is grown, the dielectric material is removed by wet etch to detach the carrier substrate. The group III-V semiconductor structure includes a thick gallium nitride layer of at least 100 microns or a light-emitting structure.
Public/Granted literature
- US20120104409A1 FORMING LIGHT-EMITTING DIODES USING SEED PARTICLES Public/Granted day:2012-05-03
Information query
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