发明授权
- 专利标题： RF module including control IC without the aid of a relay pad
- 专利标题（中）： RF模块包括控制IC，无需继电器垫
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申请号： US11618207申请日： 2006-12-29
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公开(公告)号： US08546939B2公开(公告)日： 2013-10-01
- 发明人: Kenji Sasaki , Tomonori Tanoue , Sakae Kikuchi , Toshifumi Makino , Takeshi Sato , Tsutomu Kobori , Yasunari Umemoto , Takashi Kitahara
- 申请人： Kenji Sasaki , Tomonori Tanoue , Sakae Kikuchi , Toshifumi Makino , Takeshi Sato , Tsutomu Kobori , Yasunari Umemoto , Takashi Kitahara
- 申请人地址： JP Kyoto
- 专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人地址： JP Kyoto
- 代理机构： Mattingly & Malur, PC
- 优先权： JP2006-037931 20060215
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L29/66 ; H01L23/52 ; H01L23/48 ; H01L29/40 ; H03F1/00 ; H03F3/14 ; H03F3/04 ; H03F3/68 ; H04B1/06 ; H04B7/00 ; H04B1/28
摘要：
A technology is provided so that RF modules used for cellular phones etc. can be reduced in size. Over a wiring board constituting an RF module, there are provided a first semiconductor chip in which an amplifier circuit is formed and a second semiconductor chip in which a control circuit for controlling the amplifier circuit is formed. A bonding pad over the second semiconductor chip is connected with a bonding pad over the first semiconductor chip directly by a wire without using a relay pad. In this regard, the bonding pad formed over the first semiconductor chip is not square but rectangular (oblong).
公开/授权文献
- US20070190962A1 RF MODULE AND MANUFACTURING THE SAME 公开/授权日：2007-08-16
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