发明授权
US08551202B2 Iodate-containing chemical-mechanical polishing compositions and methods 有权
含碘酸的化学机械抛光组合物和方法

Iodate-containing chemical-mechanical polishing compositions and methods
摘要:
The invention provides compositions and methods for planarizing or polishing a substrate. The composition comprises an abrasive, iodate ion, a nitrogen-containing compound selected from the group consisting of a nitrogen-containing C4-20 heterocycle and a C1-20 alkylamine, and a liquid carrier comprising water.
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