Invention Grant
- Patent Title: Micro device array for transfer to a receiving substrate
- Patent Title (中): 用于转移到接收基板的微器件阵列
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Application No.: US13708704Application Date: 2012-12-07
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Publication No.: US08558243B2Publication Date: 2013-10-15
- Inventor: Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
- Applicant: LuxVue Technology Corporation
- Applicant Address: US CA Santa Clara
- Assignee: LuxVue Technology Corporation
- Current Assignee: LuxVue Technology Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L29/18 ; H01L23/02 ; H01L21/00
Abstract:
A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
Public/Granted literature
- US20130128585A1 MICRO DEVICE ARRAY Public/Granted day:2013-05-23
Information query
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